MTS – ASIC Silicon Debug, Device Technology & Yield Engineering

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 12+ yearsSkills: ["Root-cause analysis","Cross-functional leadership","Technical communication","Hypothesis-driven problem solving","Mentorship"]

Lead end-to-end investigation of silicon yield loss, field returns, RMA, and reliability failures for complex ASICs. Drive root-cause analysis across process, design, test, packaging, and system interactions, including post-silicon debug and characterization. Execute advanced physical failure analysis (e.g., FIB/SEM/TEM/EFA) and correlate findings with manufacturing and reliability data. Coordinate cross-functional technical reviews and feed silicon learnings into next-generation ASIC architecture and process improvements.

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FursaFursa
Micron Technology
Micron Technology
6 days ago

MTS – ASIC Silicon Debug, Device Technology & Yield Engineering

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Last checked: 10 hours agoStatus: Live

Job Summary

Lead end-to-end investigation of silicon yield loss, field returns, RMA, and reliability failures for complex ASICs. Drive root-cause analysis across process, design, test, packaging, and system interactions, including post-silicon debug and characterization. Execute advanced physical failure analysis (e.g., FIB/SEM/TEM/EFA) and correlate findings with manufacturing and reliability data. Coordinate cross-functional technical reviews and feed silicon learnings into next-generation ASIC architecture and process improvements.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures.
  • •Drive root-cause analysis across process, design, test, package, and system interactions for complex ASIC failures.
  • •Plan and execute post-silicon debug and characterization activities, coordinating with design, DFT, product engineering, quality, reliability, foundry, and customer support.
  • •Run advanced physical failure analysis (e.g., FIB, SEM/TEM, EFA, OBIRCH, LVP, emission microscopy) and translate results into clear engineering actions.
  • •Lead technical reviews and present complex findings to executive leadership, influencing design and technology roadmaps to improve robustness and yield learning.

Pay and Benefits

Perks:Paid LeaveWellness StipendHealth InsuranceEquity

Key Requirements

  • •12+ years of semiconductor industry experience with advanced CMOS technology and silicon product development.
  • •Proven success leading yield improvement, RMA, and failure analysis efforts, including end-to-end RCA for silicon issues.
  • •Strong expertise in SRAM architecture, memory margin analysis, and reliability-induced failure mechanisms.
  • •Experience with high-speed interfaces and analog/mixed-signal debug, including PCIe, ONFI, and SerDes.
  • •Ability to develop hypothesis-driven debug strategies and coordinate cross-functional execution with foundries and OSAT partners.
Experience:12+ yearsSemiconductorASICSilicon debugCMOSMemoryStorageFoundriesOSAT
Skills:Root-cause analysisCross-functional leadershipTechnical communicationHypothesis-driven problem solvingMentorship
Tech Stack:ASICYieldRMAWafer Acceptance Test (WAT)DFTSRAMPCIeONFISerDesSignal integrity (SI)Power integrity (PI)Timing closureProcess-design interaction analysisVariation-aware designFIBSEMTEMEFAOBIRCHLVP

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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