Intel

2 weeks ago

Advanced Packaging Lithography Development Manager

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 13 hours agoStatus: Live

Job Summary

Lead lithography module development for next-generation semiconductor packaging, focusing on Foveros Direct technologies. Manage a team of process engineers while driving patterning flow definition and process development. Own long-term process roadmaps, project schedules, and cross-functional delivery, and lead lithography yield improvement and defect reduction initiatives. Partner with process integration and manufacturing operations to enable seamless technology transfer to high-volume manufacturing and influence Intel’s advanced packaging roadmap.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Manager level

Key Responsibilities

•Lead and manage a team of engineers, setting goals, coaching, and performance management to foster an innovative environment.
•Develop long-term process roadmaps to meet future advanced packaging requirements.
•Develop and execute project schedules, tracking milestones and deliverables across cross-functional teams.
•Drive lithography module and segment-related yield improvement initiatives and defect reduction programs.
•Partner with process integration and manufacturing operations to achieve manufacturing excellence and technology transfer to high-volume manufacturing.

Pay and Benefits

Salary: USD 155,520 - 298,440 annually

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Master’s or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
•6+ years of relevant experience with a master’s degree, or 5+ years with a PhD.
•Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment.
•Extensive experience in lithography process optimization and yield enhancement/manufacturing readiness.
•Project management experience building schedules, tracking deliverables, and coordinating cross-functional collaborations.

Experience:5+ yearsSemiconductor manufacturingAdvanced packagingLithography

Education:Master's

Skills:CommunicationCollaborationStrategic thinkingCoachingProblem-solving

Tech Stack:ASMLCanonNikonScanner/stepperTrack equipmentLithographyProcess optimizationYield enhancementDefect reductionDesign of Experiments (DOE)Foveros DirectPackage interconnect technologies

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

2 weeks ago

Advanced Packaging Lithography Development Manager

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 13 hours agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Manager level

Key Responsibilities

•Lead and manage a team of engineers, setting goals, coaching, and performance management to foster an innovative environment.
•Develop long-term process roadmaps to meet future advanced packaging requirements.
•Develop and execute project schedules, tracking milestones and deliverables across cross-functional teams.
•Drive lithography module and segment-related yield improvement initiatives and defect reduction programs.
•Partner with process integration and manufacturing operations to achieve manufacturing excellence and technology transfer to high-volume manufacturing.

Pay and Benefits

Salary: USD 155,520 - 298,440 annually

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Master’s or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
•6+ years of relevant experience with a master’s degree, or 5+ years with a PhD.
•Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment.
•Extensive experience in lithography process optimization and yield enhancement/manufacturing readiness.
•Project management experience building schedules, tracking deliverables, and coordinating cross-functional collaborations.

Experience:5+ yearsSemiconductor manufacturingAdvanced packagingLithography

Education:Master's

Skills:CommunicationCollaborationStrategic thinkingCoachingProblem-solving

Tech Stack:ASMLCanonNikonScanner/stepperTrack equipmentLithographyProcess optimizationYield enhancementDefect reductionDesign of Experiments (DOE)Foveros DirectPackage interconnect technologies

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor