Technical Director, Advanced Packaging Integration

Applied Materials
Singapore
Workplace: OnsiteFull timeFunction: Executive & General ManagementEducation: mastersSkills: ["Leadership","Cross-functional collaboration","Root-cause analysis","Data-driven decision-making","Technical communication"]

Lead advanced packaging process integration within Applied Materials’ Advanced Packaging division, driving next-generation 2.xD packaging concepts and end-to-end panel-level process flows. Own complex technology development projects, including materials selection and compatibility for large form factor substrates. Partner with customers and internal teams to align process specifications and acceptance criteria, analyze process data to improve yield and reliability, and publish findings. Mentor early-career engineers and guide technical direction across geographies.

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Applied Materials
Applied Materials
3 days ago

Technical Director, Advanced Packaging Integration

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Job Summary

Lead advanced packaging process integration within Applied Materials’ Advanced Packaging division, driving next-generation 2.xD packaging concepts and end-to-end panel-level process flows. Own complex technology development projects, including materials selection and compatibility for large form factor substrates. Partner with customers and internal teams to align process specifications and acceptance criteria, analyze process data to improve yield and reliability, and publish findings. Mentor early-career engineers and guide technical direction across geographies.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management
Seniority: Director level

Key Responsibilities

  • •Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies.
  • •Define, document, and implement end-to-end process flows for panel-level packaging technologies.
  • •Conduct material selection, characterization, and compatibility assessments for large form factor substrates.
  • •Collaborate with customers and internal business units to align process specifications and acceptance criteria, including module co-optimization and technology transfer.
  • •Analyze process data to identify trends, drive optimization, and improve yield and reliability, including root-cause analyses and corrective actions.

Key Requirements

  • •Master’s degree with 10 years of experience, or a PhD with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.
  • •In-depth, hands-on expertise with advanced 2.xD packaging technologies including fan-out panel-level packaging (FOPLP), (organic) interposer, substrate, and wafer-level back-end technologies.
  • •Strong semiconductor processing and integration knowledge (e.g., lithography, dry etch, thin film deposition, and materials modification) for wafer and/or panel-level processes.
  • •Proficiency in statistical data analysis (e.g., DoE, JMP) and strong understanding of process characterization, metrology, materials, and failure analysis.
  • •Proven capability to lead multi-functional teams to resolve complex technical problems with exceptional written and verbal communication skills.
Experience:Semiconductor processingAdvanced packagingMaterials science
Education:Master's
Skills:LeadershipCross-functional collaborationRoot-cause analysisData-driven decision-makingTechnical communication
Tech Stack:2.xD packagingFOPLPFan-out panel-level packagingOrganic interposerDoEJMPLithographyDry etchThin film depositionMetrologyMaterials failure analysis

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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