Low Yield Analysis Engineer on Shift

Intel
United States
Workplace: OnsiteFull timeUSD 99,030 - 139,810 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 1+ yearsEducation: mastersSkills: ["Analytical","Problem-solving","Communication","Presentation","Collaboration"]

Analyze and troubleshoot low-yield failures in semiconductor wafer/packaging workflows using hands-on lab testing and data-driven failure analysis. Set shift priorities, translate program milestones into team objectives, and collaborate across engineering technicians, shift engineers, module partners, and customers. Plan data acquisition and recommend corrective actions, while developing failure analysis techniques and consulting on packaging/assembly problems to improve manufacturing yield.

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FursaFursa
Intel
Intel
2 days ago

Low Yield Analysis Engineer on Shift

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live

Job Summary

Analyze and troubleshoot low-yield failures in semiconductor wafer/packaging workflows using hands-on lab testing and data-driven failure analysis. Set shift priorities, translate program milestones into team objectives, and collaborate across engineering technicians, shift engineers, module partners, and customers. Plan data acquisition and recommend corrective actions, while developing failure analysis techniques and consulting on packaging/assembly problems to improve manufacturing yield.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Work across organizational boundaries to meet program deliverables and strategic objectives.
  • •Translate program milestones and schedules into team objectives and drive execution.
  • •Conduct hands-on lab work, define data acquisition strategy, analyze data, and recommend corrective actions to customers.
  • •Develop failure analysis techniques (BKMs/approaches) to accelerate failure identification and mechanism understanding.
  • •Provide consultation on packaging and/or assembly problems and improvements to manufacturing processes.

Pay and Benefits

Salary: USD 99,030 - 139,810 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •Master's Degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics (or related field).
  • •At least 1 year of prior lab experience.
  • •Defect characterization or electrical fault isolation techniques through work, schoolwork, internships, or similar.
  • •Experience working in a lab environment.
  • •Experience with destructive/optical analysis techniques (e.g., manual cross-sectioning/delayering, SEM, X-ray, microscopy, CSAM, ion milling, TEM, FIB).
Experience:1+ years
Education:Master's
Skills:AnalyticalProblem-solvingCommunicationPresentationCollaboration
Tech Stack:SEMX-rayMicroscopyCSAMIon millingTEMFIBHand probeCurve traceAuto probingTDREOTPREBACRIDRELITEEDXAFMFTIRRamanXRD

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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