FE CPIE PI Principal/Staff Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Cross-functional collaboration","Process optimization","Alignment","Problem-solving"]

Drive best-in-class product maturity for semiconductor yield and product grade metrics, including bits per wafer, repair density, and DPM. Apply deep knowledge of FEOL/MOL/CELL/BEOL process integration to optimize solutions and accelerate learning cycles. Collaborate with YE, Device, RDA, and Metrology teams to resolve top yield issues, build inline visibility for faster yield ramp, and standardize methods across DRAM/NAND sites. Travel to Micron sites as needed.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

FE CPIE PI Principal/Staff Engineer

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Last checked: 6 hours agoStatus: Live

Job Summary

Drive best-in-class product maturity for semiconductor yield and product grade metrics, including bits per wafer, repair density, and DPM. Apply deep knowledge of FEOL/MOL/CELL/BEOL process integration to optimize solutions and accelerate learning cycles. Collaborate with YE, Device, RDA, and Metrology teams to resolve top yield issues, build inline visibility for faster yield ramp, and standardize methods across DRAM/NAND sites. Travel to Micron sites as needed.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive best-in-class product maturity for bits per wafer (yield) and product grades (Repair Density and DPM) at the fastest speed and learning cycle.
  • •Use deep knowledge of FEOL/MOL/CELL/BEOL processes to identify optimal integration solutions for target outcomes.
  • •Collaborate with YE, Device, RDA, and Metrology teams to resolve top yield issues and develop inline visibility for faster yield ramp while minimizing excursions.
  • •Identify and drive alignment by standardizing best known methods and business processes across DRAM/NAND sites.
  • •Travel to Micron sites as necessary for face-to-face collaboration.
Travel: Low travel

Key Requirements

  • •In-depth knowledge of semiconductor process integration across FEOL, MOL, CELL, and BEOL loops.
  • •Experience driving yield and product maturity metrics such as bits per wafer, product grades, Repair Density, and DPM.
  • •Ability to identify and implement optimal process integration solutions to achieve fast learning-cycle goals.
  • •Experience collaborating cross-functionally with teams such as Yield Engineering (YE), Device, RDA, and Metrology to resolve top yield issues.
  • •Strong understanding of DRAM/NAND business processes and the ability to standardize alignment across network sites.
Experience:SemiconductorMemoryDRAMNAND
Skills:Cross-functional collaborationProcess optimizationAlignmentProblem-solving

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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