Broadcom

4 months ago

IC Package Design / Development

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 9 hours agoStatus: Live

Job Summary

Senior hardware packaging role driving next-generation IC package architecture, design, and integration across cross-functional teams (chip design, SI/PI, thermal, and manufacturing) for advanced nodes, with emphasis on substrate design, floor-planning, bump architecture, and HVM execution.

Location: San Jose, Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

•Own packaging deliverables from concept through substrate design, development, qualification, and high-volume manufacturing.
•Lead interactions with assembly, substrate, and manufacturing partners for NPI bring-up and production ramp.
•Provide sustaining support during HVM, including multi-source enablement.
•Work with QA, product/test engineering, and customer teams to diagnose and resolve quality, reliability, or manufacturing issues.
•Define and refine assembly BOM, process flows, and design rules for advanced packaging technologies.

Pay and Benefits

Salary: USD 108,000 - 192,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityEsppEapPaid HolidaysPaid Leave

Key Requirements

•Bachelor’s degree and 8+ years, or Master’s degree and 6+ years, or PhD and 3+ years of related experience
•BS/MS/PhD in Electrical Engineering (Preferred) or Mechanical Engineering, Materials Science, or related field
•Extensive hands-on experience in advanced IC packaging for advanced silicon nodes
•Expertise in substrate design, SI/PI principles, thermal management, and high-speed IO packaging
•Strong understanding of high layer count, large body, flip chip BGA packaging technology

Experience:8+ yearsSemiconductorHardwareIC packaging

Education:Bachelor's in Electrical Engineering

Skills:CommunicationLeadershipProblem-solving

Tech Stack:Cadence AllegroAPDSIPCadence APDCADENCEBGASubstrate designSI/PI

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

4 months ago

IC Package Design / Development

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 9 hours agoStatus: Live

Job Summary

Location: San Jose, Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

•Own packaging deliverables from concept through substrate design, development, qualification, and high-volume manufacturing.
•Lead interactions with assembly, substrate, and manufacturing partners for NPI bring-up and production ramp.
•Provide sustaining support during HVM, including multi-source enablement.
•Work with QA, product/test engineering, and customer teams to diagnose and resolve quality, reliability, or manufacturing issues.
•Define and refine assembly BOM, process flows, and design rules for advanced packaging technologies.

Pay and Benefits

Salary: USD 108,000 - 192,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityEsppEapPaid HolidaysPaid Leave

Key Requirements

•Bachelor’s degree and 8+ years, or Master’s degree and 6+ years, or PhD and 3+ years of related experience
•BS/MS/PhD in Electrical Engineering (Preferred) or Mechanical Engineering, Materials Science, or related field
•Extensive hands-on experience in advanced IC packaging for advanced silicon nodes
•Expertise in substrate design, SI/PI principles, thermal management, and high-speed IO packaging
•Strong understanding of high layer count, large body, flip chip BGA packaging technology

Experience:8+ yearsSemiconductorHardwareIC packaging

Education:Bachelor's in Electrical Engineering

Skills:CommunicationLeadershipProblem-solving

Tech Stack:Cadence AllegroAPDSIPCadence APDCADENCEBGASubstrate designSI/PI

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn