Dry/Plasma Etch Manufacturing Process Engineer (DMOS6)

Texas Instruments
Dallas
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Self-directed","Analytical thinking","Problem solving","Communication","Team collaboration"]

Drive continual improvement for dry/plasma etch manufacturing in a 300mm wafer fab, supporting 24/7 operations and high-volume production. Develop and implement methods, procedures, and process changes to improve efficiency, yields, machine operations, and quality. Lead project and improvement plans for cost, efficiency, and new product support, performing lot/equipment dispositions, process experiments, and data analysis to resolve systematic process or equipment issues.

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FursaFursa
Texas Instruments
Texas Instruments
1 day ago

Dry/Plasma Etch Manufacturing Process Engineer (DMOS6)

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Drive continual improvement for dry/plasma etch manufacturing in a 300mm wafer fab, supporting 24/7 operations and high-volume production. Develop and implement methods, procedures, and process changes to improve efficiency, yields, machine operations, and quality. Lead project and improvement plans for cost, efficiency, and new product support, performing lot/equipment dispositions, process experiments, and data analysis to resolve systematic process or equipment issues.
Location: Dallas
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Support 24/7 manufacturing operations.
  • •Develop and implement improved manufacturing methods, procedures, and processes to increase efficiencies, yields, machine operations, and quality.
  • •Implement project or improvement plans for efficiency improvements, cost reduction, quality improvement, new product support, and other process improvements.
  • •Perform lot and equipment dispositions to maintain continuous production flow and minimize cycle time in a high-volume 300mm wafer fab.
  • •Identify systematic problems in process or equipment, communicate findings to engineering, and support manufacturing ramp with equipment/process startup and process experiments (SWRs).

Key Requirements

  • •5 years of experience as a Dry/Plasma Etch process engineer.
  • •Bachelor’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field.
  • •Strong foundation in statistical process control (SPC), engineering change control, and process release strategies.
  • •Support manufacturing ramp execution including equipment/process startup and process experiments (SWRs).
  • •Ability to participate in data analysis and problem resolution.
Education:Bachelor's
Skills:Self-directedAnalytical thinkingProblem solvingCommunicationTeam collaboration
Tech Stack:Dry/Plasma Etch300mm wafer fabStatistical process controlEngineering change controlProcess release strategiesLot and equipment dispositionsProcess experiments (SWRs)Data analysisProcess improvement

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn