Advanced Package Thermal Technologist

AMD
Austin
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringEducation: mastersSkills: ["Self-directed","Technical leadership","Autonomy","Clear communication","Collaboration"]

Define and drive next-generation package-centric thermal modeling and architecture decisions using model-based, system-technology co-optimization (STCO). Build, validate, and apply thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal, electro-optical) to guide SoC/package/board and cooling solutions. Partner with internal/external labs, engage suppliers and partners on materials and assumptions, and influence data center and HPC product roadmaps as a thermal subject-matter expert.

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FursaFursa
AMD
AMD
23 hours ago

Advanced Package Thermal Technologist

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Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Define and drive next-generation package-centric thermal modeling and architecture decisions using model-based, system-technology co-optimization (STCO). Build, validate, and apply thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal, electro-optical) to guide SoC/package/board and cooling solutions. Partner with internal/external labs, engage suppliers and partners on materials and assumptions, and influence data center and HPC product roadmaps as a thermal subject-matter expert.
Location: Austin
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
  • •Develop and maintain thermal and multi-physics models and define validation strategies, partnering with internal and external labs for STCO across silicon, package, board, and platform.
  • •Align material properties, process capabilities, and modeling assumptions with suppliers, partners, and component vendors to meet architecture and STCO needs.
  • •Set targets and strategic direction for thermal and package technology development, assess readiness, and influence product roadmaps.
  • •Serve as a thermal subject-matter expert for SoC, package, and system-level architectures, with a primary focus on data center platforms.

Key Requirements

  • •Own and drive model-based architecture and design decisions using SoC, package, and system-level thermal modeling, characterization, and validation.
  • •Strong thermal and CFD understanding with multi-physics SoC-package-system design and assembly trade-offs.
  • •Background in advanced PCB technologies, including materials, designs, and assembly constraints.
  • •Experience integrating electro-thermal and electro-optical technologies at the board and package level with modeling-to-experiment correlation.
  • •MS or PhD in a relevant Engineering discipline or physics.
Education:Master's
Skills:Self-directedTechnical leadershipAutonomyClear communicationCollaboration
Languages:En-us
Tech Stack:Thermal modelingCFDMulti-physics modelingThermo-mechanical modelingElectro-thermalElectro-opticalSTCODOEAI/MLSurrogate modelingReduced-order modelingAutomated optimization pipelinesAnomaly/failure detectionSMTConnectors

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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