Staff Engineer, Package Development & Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Product ManagementExperience: 8+ yearsSkills: ["Technical communication","Leadership"]

Provide technical leadership for advanced packaging initiatives within the Advanced Packaging & Technology Development organization. Own the end-to-end lifecycle of PDE technology pillars, drive roadmap execution, and lead cross-functional engineering teams to hit technology milestones. Establish governance and standardized program management methodologies, align pillar objectives with analytics/simulation/modeling in workflows, and monitor KPIs for maturity, yield, and EOL accountability while mentoring engineers.

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FursaFursa
Micron Technology
Micron Technology
6 months ago

Staff Engineer, Package Development & Engineering

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Last checked: 7 hours agoStatus: Live

Job Summary

Provide technical leadership for advanced packaging initiatives within the Advanced Packaging & Technology Development organization. Own the end-to-end lifecycle of PDE technology pillars, drive roadmap execution, and lead cross-functional engineering teams to hit technology milestones. Establish governance and standardized program management methodologies, align pillar objectives with analytics/simulation/modeling in workflows, and monitor KPIs for maturity, yield, and EOL accountability while mentoring engineers.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.
  • •Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.
  • •Develop and enforce standardized methodologies for technical program management and pillar governance.
  • •Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems while ensuring compliance with internal governance models and customer technical requirements.
  • •Define and monitor KPIs for technology maturity, yield performance, and EOL accountability; conduct technical reviews and mentor engineers.

Key Requirements

  • •Bachelor’s or Master’s degree in Engineering, Materials Science, or a related technical discipline.
  • •8+ years of experience in semiconductor packaging, process integration, or technology development.
  • •Proven ability to lead complex, cross-functional technical programs in a high-tech environment.
  • •Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
  • •Strong technical communication and leadership skills.
Experience:8+ years
Education:
Skills:Technical communicationLeadership
Tech Stack:Advanced packagingHybrid bondingCoWoSChiplet integrationSimulation modelingYield enhancementDefectivity analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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