Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 15-20 yearsEducation: phdSkills: ["Leadership","Mentoring","Problem-solving","Technical collaboration","Technical communication"]

Lead technical strategy and multi-functional initiatives for 3D NAND advanced thin film process development. Architect solutions across structural and electric film development, drive standards and process improvements, and fix/integrate advanced processes through root-cause analysis and corrective actions. Correlate process parameters to device performance using characterization tools (e.g., SIMS, XPS, TEM) and reliability modeling, while mentoring engineers and collaborating globally to advance hardware/process capability.

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Micron Technology
Micron Technology
4 months ago

Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

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Job Summary

Lead technical strategy and multi-functional initiatives for 3D NAND advanced thin film process development. Architect solutions across structural and electric film development, drive standards and process improvements, and fix/integrate advanced processes through root-cause analysis and corrective actions. Correlate process parameters to device performance using characterization tools (e.g., SIMS, XPS, TEM) and reliability modeling, while mentoring engineers and collaborating globally to advance hardware/process capability.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Set technical strategy and lead multi-functional projects in structural and electric thin film development.
  • •Architect solutions and promote innovative technologies across teams; influence technical standards and drive process improvements.
  • •Lead advanced process development including fixing and integration, using root-cause analysis, FMEA, SPC, and corrective actions to recover without yield trade-off.
  • •Correlate process parameters to device performance using advanced characterization and develop correlation models to predict reliability and scaling.
  • •Mentor engineers through structured training and hands-on development, and participate in global collaborations aligned with Micron’s engineering expectations.

Key Requirements

  • •PhD (or equivalent) in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related fields.
  • •15 to 20 years of Thin Film R&D for NAND process, specifically plasma and thermal CVD for dielectric (high-k/low-k) and carbon-based depositions.
  • •Demonstrated leadership in multi-functional development and vendor collaboration.
  • •Proven track record architecting solutions, process-device correlation, and mentoring engineers aligned with SMTS leadership expectations.
Experience:15-20 yearsNAND3D NANDThin film research & development
Education:PhD / Doctorate in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related field
Skills:LeadershipMentoringProblem-solvingTechnical collaborationTechnical communication
Tech Stack:Plasma Enhanced CVDThermal CVDALDSIMSXPSTEMEDXEELSElectrical stress testingTDSFMEASPCRoot cause analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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