Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Manufacturing & Production OperationsEducation: bachelorsSkills: ["Problem-solving","Attention to detail","Team collaboration","Mentorship","Effective communication"]

Drive Media Health manufacturing execution for next-generation High Bandwidth Memory (HBM) products, taking technical ownership of Quality, Cost, Cycle Time, and Scale. Develop and validate manufacturing test flows, improve device/stack-level yield, and enhance extrinsic and intrinsic reliability via deep circuit debug and test strategy. Contribute to Design-For-Test (DFT) strategy, reduce test time, and partner cross-functionally with Fab, product and design engineering, and test solutions teams while mentoring others.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live

Job Summary

Drive Media Health manufacturing execution for next-generation High Bandwidth Memory (HBM) products, taking technical ownership of Quality, Cost, Cycle Time, and Scale. Develop and validate manufacturing test flows, improve device/stack-level yield, and enhance extrinsic and intrinsic reliability via deep circuit debug and test strategy. Contribute to Design-For-Test (DFT) strategy, reduce test time, and partner cross-functionally with Fab, product and design engineering, and test solutions teams while mentoring others.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Manufacturing & Production Operations

Key Responsibilities

  • •Own optimized test coverage for current and future HIG HBM design architectures and process nodes to support high-volume manufacturing.
  • •Develop, validate, characterize, and qualify next-generation HBM products, ensuring reliability and readiness for market.
  • •Support new product design validation using CAD tools and Verilog simulations.
  • •Improve manufacturing test yields (device issues, interface and stacked die yield), reduce test time, and resolve yield-related issues.
  • •Collaborate cross-functionally (Fab, HBM technology/design/system development, quality/reliability) and mentor others while driving innovation and technical decision-making.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
  • •Solid problem-solving skills with a focus on root-cause identification and exploring solution spaces.
  • •Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • •Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • •Clear written and spoken English communication skills for articulating technical concepts and findings.
Experience:SemiconductorsManufacturingHBM
Education:Bachelor's in Electrical and Electronics Engineering
Skills:Problem-solvingAttention to detailTeam collaborationMentorshipEffective communication
Languages:English
Tech Stack:PythonJMPVerilogCADCMOSDRAMHBMDFTStatisticsData analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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