Dry Etch Process Develop Engineer

Micron Technology
New York
Workplace: RemoteFull timeUSD 107,000 - 182,000 annuallyFunction: Communications, PR & CommunitySkills: ["Data-driven improvement","Root-cause analysis","Statistical data analysis","Cross-functional collaboration","Clear communication"]

Build, integrate, and optimize plasma dry etch processes for next-generation memory devices, working hands-on with etch equipment, chamber hardware, consumables, and metrology. Drive improvements in critical metrics like CD control, profile, selectivity, uniformity, and defect performance using data-driven methods (DOEs and SPC). Collaborate across integration, lithography, thin films, CMP, device, and manufacturing teams to mature processes into high-volume production.

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Micron Technology
Micron Technology
2 weeks ago

Dry Etch Process Develop Engineer

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Job Summary

Build, integrate, and optimize plasma dry etch processes for next-generation memory devices, working hands-on with etch equipment, chamber hardware, consumables, and metrology. Drive improvements in critical metrics like CD control, profile, selectivity, uniformity, and defect performance using data-driven methods (DOEs and SPC). Collaborate across integration, lithography, thin films, CMP, device, and manufacturing teams to mature processes into high-volume production.
Location: New York
Workplace: Remote
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies.
  • •Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness.
  • •Drive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysis.
  • •Perform root-cause analysis for process excursions, tool health issues, and integration-related failures; implement corrective actions.
  • •Partner with equipment vendors on chamber matching, hardware and recipe development, and document process baselines/change controls while supporting technology transition to production.

Pay and Benefits

Salary: USD 107,000 - 182,000 annually
Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental Leave

Key Requirements

  • •M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related field relevant to plasma processing and semiconductor manufacturing.
  • •B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch (will also be considered).
  • •Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
  • •Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
  • •Ability to collaborate effectively across multi-functional technical teams and communicate results clearly.
Experience:SemiconductorManufacturing
Skills:Data-driven improvementRoot-cause analysisStatistical data analysisCross-functional collaborationClear communication
Tech Stack:Dry etchPlasma etchPlasma processingEUV lithographyLithographyThin filmsCMPICP/RIEChamber hardwareMetrologyCD controlDOEsSPCStatistical data analysisEUV photo lithographyDefect characterizationTool health monitoringARDEMicroloadingLine edge roughness

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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