Packaging Engineer

AMD
Taiwan
Workplace: OnsiteFull timeTWD 1,691,060 - 2,415,800 annuallyFunction: Industrial, Process & Manufacturing EngineeringSkills: ["Cross-functional project management","Conflict management","Analytics","Troubleshooting","Presentation"]

Drive supplier engagement for external flip chip bumping, fan-out, RDL, and on-substrate assembly manufacturers to meet key performance indices like yield and excursion-free outcomes. Plan and execute new product introduction and ramp-up readiness, lead issue resolution and prevention using leading indicators, and monitor supplier performance for outliers. Support change management, special work requests with comprehensive reporting, and occasional on-site audits and travel.

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FursaFursa
AMD
AMD
2 days ago

Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Drive supplier engagement for external flip chip bumping, fan-out, RDL, and on-substrate assembly manufacturers to meet key performance indices like yield and excursion-free outcomes. Plan and execute new product introduction and ramp-up readiness, lead issue resolution and prevention using leading indicators, and monitor supplier performance for outliers. Support change management, special work requests with comprehensive reporting, and occasional on-site audits and travel.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Engage suppliers for continuous improvement and new capabilities ahead of need.
  • •Plan and drive new product introduction activities and ramp-up readiness.
  • •Drive issue resolution and prevention with leading indicators to proactively identify risks.
  • •Monitor external manufacturing performance including yield, out-of-control lot disposition, and outlier reporting.
  • •Plan and execute change management and support special work requests with comprehensive reporting; occasionally support on-site audits and travel.
Travel: Low travel

Pay and Benefits

Salary: TWD 1,691,060 - 2,415,800 annually

Key Requirements

  • •Strong knowledge of bumping/fan-out/RDL processes, including Flip Chip assembly and advanced package as an added advantage.
  • •Proven experience in process development, qualification, and high-volume manufacturing in a semiconductor ASIC environment.
  • •Familiarity with tools including AI agents, JMP, and Minitab, plus failure analysis and package reliability knowledge.
  • •Familiarity with industry standards including ESD and JEDEC, and automotive.
  • •Bachelor’s/MS degree in Mechanical, Material, or Chemical Engineering.
Experience:SemiconductorASICHigh-volume manufacturing
Education:
Skills:Cross-functional project managementConflict managementAnalyticsTroubleshootingPresentation
Languages:English
Tech Stack:AI agentsJMPMinitabESDJEDECFailure analysisPackage reliability

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn