Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 124,000 - 171,000 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: mastersSkills: ["Problem-solving","Communication","Collaboration","Self-starting","Interpersonal skills"]

Join the Photonics Platforms Business Group to develop die-to-wafer (D2W) hybrid bonding R&D. You’ll create and optimize bonding processes, perform surface preparation and plasma activation, and run high-accuracy die placement and alignment. Drive DOE-driven experiments, process optimization, failure analysis, and integration with modules like die preparation, die thinning, and gap fill/planarization, working with a cross-functional research team using state-of-the-art equipment.

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Applied Materials
Applied Materials
1 week ago

Process Engineer – Die to Wafer Hybrid Bonding

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Last checked: 6 hours agoStatus: Live
Reposted: similar role first listed 5 months ago

Job Summary

Join the Photonics Platforms Business Group to develop die-to-wafer (D2W) hybrid bonding R&D. You’ll create and optimize bonding processes, perform surface preparation and plasma activation, and run high-accuracy die placement and alignment. Drive DOE-driven experiments, process optimization, failure analysis, and integration with modules like die preparation, die thinning, and gap fill/planarization, working with a cross-functional research team using state-of-the-art equipment.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Develop die-to-wafer hybrid bonding processes, including surface preparation/plasma activation and high-accuracy die placement and alignment.
  • •Conduct post-bond characterization and process evaluation to understand performance and process limits.
  • •Integrate D2W bonding with adjacent process modules such as dicing/die preparation, die thinning, and inter-die gap fill/planarization.
  • •Design and execute DOE-driven experiments to identify sensitivities and trade-offs.
  • •Own process optimization, perform failure analysis/characterization, and drive continuous engineering improvement.
Travel: Low travel

Pay and Benefits

Salary: USD 124,000 - 171,000 annually
Equity and Bonus:Equity

Key Requirements

  • •Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
  • •Hands-on experience with die-to-wafer (D2W) or wafer-to-wafer bonding, including thin-die handling and alignment-critical processes.
  • •Experience with micro-LED or CPO, heterogeneous integration (e.g., III-V to Si), and/or 2.5D/3D integration.
  • •Direct process engineer experience on mainstream semiconductor equipment (e.g., plasma, wet clean, overlay/alignment).
  • •Strong understanding of bond interface physics, alignment/overlay fundamentals, mechanical behavior of thin dies, and statistical process control (DOE, SPC, JMP).
Education:Master's
Skills:Problem-solvingCommunicationCollaborationSelf-startingInterpersonal skills
Tech Stack:Die-to-wafer hybrid bonding2.5D3D integrationHybrid bondingSurface preparationPlasma activationHigh-accuracy alignmentDie placementBond characterizationDOESPCJMPFailure analysisContinuous engineering improvementDicingDie preparationDie thinningInter-die gap fillPlanarizationAtomic force microscopy

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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