Intern - HBM SoC Physical Design Engineer

Micron Technology
United States
Workplace: OnsiteInternshipUSD 38.84 - 50.24 hourlyFunction: Design (Product/UX/UI/Visual)0Education: mastersSkills: ["Analytical","Problem-solving","Communication","Teamwork"]

Support physical design implementation for advanced HBM SoC and base die designs, working on floorplanning, placement, clock tree synthesis, routing, and optimization. Perform timing analysis for timing closure and debug across modes and process corners, evaluating timing, power, area, congestion, and physical verification. Build automation tools, scripts, and reports using Python, Tcl, and shell, and collaborate with cross-functional engineering teams to present results.

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FursaFursa
Micron Technology
Micron Technology
6 days ago

Intern - HBM SoC Physical Design Engineer

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Last checked: 4 hours agoStatus: Live

Job Summary

Support physical design implementation for advanced HBM SoC and base die designs, working on floorplanning, placement, clock tree synthesis, routing, and optimization. Perform timing analysis for timing closure and debug across modes and process corners, evaluating timing, power, area, congestion, and physical verification. Build automation tools, scripts, and reports using Python, Tcl, and shell, and collaborate with cross-functional engineering teams to present results.
Location: United States
Workplace: Onsite
Employment Type: Internship
Job Function: Design (Product/UX/UI/Visual)
Seniority: Intern level

Key Responsibilities

  • •Support physical implementation of SoC design blocks, including floorplanning, placement, clock tree synthesis, routing, and physical optimization.
  • •Analyze timing, power, area, congestion, and physical verification results to identify optimization opportunities.
  • •Assist with static timing analysis, timing closure, and debugging across multiple operating modes and process corners.
  • •Develop and enhance automation tools, scripts, reports, and workflows using Python, Tcl, shell scripting, and AI-assisted solutions.
  • •Collaborate with multi-functional engineering teams to document results, participate in design reviews, and present findings.

Pay and Benefits

Salary: USD 38.84 - 50.24 hourly
Perks:Paid Time-offLearning BudgetWellness StipendEquityHealth Insurance

Key Requirements

  • •0-2 years of relevant experience via internships, research, coursework, or academic projects in ASIC/VLSI/digital IC design or physical design.
  • •Currently pursuing a Master’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
  • •Knowledge of ASIC design flow concepts including synthesis, place-and-route, static timing analysis, and physical verification.
  • •Understanding of timing fundamentals such as setup/hold analysis, clock skew, timing constraints, and critical path analysis.
  • •Experience with programming/scripting languages such as Python, Tcl, Perl, and/or Shell.
Experience:0ASIC designVLSIDigital IC designPhysical designHBMSoC
Education:Master's in Electrical Engineering, Computer Engineering, or related technical field
Skills:AnalyticalProblem-solvingCommunicationTeamwork
Tech Stack:PythonTclPerlShellAI-assisted solutionsCopilotClaudeLLMsCadence InnovusCadence TempusSynopsys ICC2Synopsys PrimeTimeSiemens CalibreRTL-to-GDSIIStatic timing analysisPlace-and-route

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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