Principal Engineer- HIG HBM Layout

Micron Technology
Hyderabad
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 15+ yearsEducation: bachelorsSkills: ["Communication","Team leadership","Collaboration","Multitasking","Analytical thinking"]

Lead Micron’s HBM layout efforts in Hyderabad by designing and developing complex analog/custom integrated circuit layouts for high-bandwidth memory used in AI and high-performance computing. Own die design understanding, floorplanning and manual routing, and optimize performance, power, and area. Guide multiple custom IC layout projects through tape-out readiness, build and grow the layout team, and collaborate with internal and external stakeholders while documenting specifications.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Principal Engineer- HIG HBM Layout

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live
Reposted: first listed 17 hours ago

Job Summary

Lead Micron’s HBM layout efforts in Hyderabad by designing and developing complex analog/custom integrated circuit layouts for high-bandwidth memory used in AI and high-performance computing. Own die design understanding, floorplanning and manual routing, and optimize performance, power, and area. Guide multiple custom IC layout projects through tape-out readiness, build and grow the layout team, and collaborate with internal and external stakeholders while documenting specifications.
Location: Hyderabad
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Manager level

Key Responsibilities

  • •Design and develop complex analog/custom IC layouts for High Bandwidth Memories aligned to product specifications.
  • •Lead die design understanding and apply architecture analysis and optimization for performance, power, and area.
  • •Build and grow the layout team while managing team performance, development, hiring, and retention.
  • •Organize tasks, allocate resources, and manage logistics across multiple layout projects for tape-out.
  • •Participate in industry standards committees, generate and communicate specifications to design teams and external customers, and support customer implementations of Micron products.

Key Requirements

  • •15+ years of analog/custom layout experience in advanced CMOS process.
  • •4+ years developing teams and project experience, including leading multiple projects and tape-out.
  • •Expertise in die components and die design principles to create effective, efficient layouts.
  • •Strong layout and floorplanning skills, including manual routing.
  • •Hands-on proficiency with Cadence VLE/VXL and Calibre DRC/LVS, plus experience building and developing a premier analog/mixed-signal layout team.
Experience:15+ yearsSemiconductorsHBMAnalog layoutMixed-signalCustom IC layoutVLSIHigh-performance computing
Education:Bachelor's in Electronic/VLSI Engineering
Skills:CommunicationTeam leadershipCollaborationMultitaskingAnalytical thinking
Tech Stack:Cadence VLE/VXLCalibre DRC/LVSCMOSMixed-signal designDie designFloor planningManual routingAnalog custom layout

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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