Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 2+ yearsEducation: phdSkills: ["Root-cause problem solving","Model-based problem solving","Collaboration","Data-driven decision making","Time management"]

Develop and enable advanced semiconductor packaging technologies for post-fab wafer finish and assembly processes, with focus on product quality, yield, cost, and productivity. Diagnose and propose yield-related breakthroughs using data analytics and correlations tied to defense mechanisms, working with Probe, Yield Analysis, Test, and Product Engineering teams. Coordinate cross-functional development and provide POR/MOR documentation to support smooth transitions from qualification through high-volume manufacturing.

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Micron Technology
Micron Technology
2 weeks ago

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

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Last checked: 6 hours agoStatus: Live

Job Summary

Develop and enable advanced semiconductor packaging technologies for post-fab wafer finish and assembly processes, with focus on product quality, yield, cost, and productivity. Diagnose and propose yield-related breakthroughs using data analytics and correlations tied to defense mechanisms, working with Probe, Yield Analysis, Test, and Product Engineering teams. Coordinate cross-functional development and provide POR/MOR documentation to support smooth transitions from qualification through high-volume manufacturing.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Develop and enable advanced package technology for various post-fab wafer finish and assembly processes to improve quality, yield, cost, and productivity.
  • •Integrate semiconductors by partnering with process and product engineering teams and identify actionable integration-flow changes based on collected/analyzed data.
  • •Improve yields through semiconductor package integration innovation and work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.
  • •Ensure defense coverage through process/measurement/inspection/testing, establish correlations to identify improvement opportunities, and continuously analyze data to enable advanced controls.
  • •Coordinate cross-functional technology development strategies, ensure smooth transition from new product development to high-volume production, and provide Process of Record (POR) and Model of Record (MOR) documentation for production transfer.

Key Requirements

  • •B.S./M.S./Ph.D. (or equivalent) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or related technical fields.
  • •2+ years of semiconductor process integration experience, including enabling advanced package technology for post-fab wafer finish and assembly processes.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics; experience with Visual Basic for automation/integration.
  • •Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • •Strong data analytics and problem-solving skills to support SPC, DOE, defect analysis, dashboarding, root-cause/model-based issue resolution, and work effectively under timelines with limited resources.
Experience:2+ yearsSemiconductorsSemiconductor process integrationAdvanced packagingManufacturingData analytics
Education:PhD / Doctorate
Skills:Root-cause problem solvingModel-based problem solvingCollaborationData-driven decision makingTime management
Tech Stack:PythonRSQLVisual BasicE3FDCRMSSPCDOEAutoCADCATIA

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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