Fellow - Lead SoC Architect

AMD
San Jose
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringEducation: mastersSkills: ["X86","ARM","GPU","AI acceleration","DSP","NPUs","Interconnect","Memory","Safety","Boot/configuration","RTL","Verification","Physical design","Firmware","Software","Platform","Chiplet","High-speed I/O"]

Lead the architecture definition and technical direction for AMD’s next-generation physical AI SoC platform. Define the overall SoC architecture, drive system-level innovation, and deliver breakthrough architectures across heterogeneous compute, AI acceleration, memory systems, high-speed interconnects, and I/O, influencing silicon strategy and cross-functional execution.

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FursaFursa
AMD
AMD
2 months ago

Fellow - Lead SoC Architect

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Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Lead the architecture definition and technical direction for AMD’s next-generation physical AI SoC platform. Define the overall SoC architecture, drive system-level innovation, and deliver breakthrough architectures across heterogeneous compute, AI acceleration, memory systems, high-speed interconnects, and I/O, influencing silicon strategy and cross-functional execution.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Own and lead the architecture for next-gen physical AI SoCs, spanning processor subsystems, GPU/AI acceleration, interconnects, memory hierarchy, and advanced I/O.
  • •Define long-term SoC architectural strategy aligned with product roadmap and customer requirements.
  • •Drive system-level analysis including performance/power modeling, silicon feasibility studies, and early floorplan architecture.
  • •Develop detailed architecture specifications for compute, memory, interconnect, safety/security, boot/configuration, and SoC management subsystems.
  • •Guide cross-functional execution across RTL design, verification, physical design, firmware, software, and platform teams.

Key Requirements

  • •MS or PhD in Electrical/Computer Engineering, or related field.
  • •Technical authority in SoC architecture with proven track record and leadership.
  • •Expertise in CPUs/GPUs/AI accelerators, memory/interconnect design, and heterogeneous compute.
  • •Experience collaborating across RTL design, verification, physical design, firmware, software, and customer engineering.
  • •Experience with Automotive, Wireless systems, and AI/ML use-cases; familiarity with high-speed I/Os and chiplet interconnect standards.
Experience:SemiconductorsSoCAIAutomotiveWireless
Education:Master's
Skills:X86ARMGPUAI accelerationDSPNPUsInterconnectMemorySafetyBoot/configurationRTLVerificationPhysical designFirmwareSoftwarePlatformChipletHigh-speed I/O
Languages:English
Tech Stack:X86ARMGPUsAI acceleratorsDSPNPUsInterconnectMemory hierarchyASICRTLVerificationPhysical designFirmwareSoftwareChipletBootSafetySecurity

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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