Staff Program Manager - Advanced Packaging Technology

Broadcom
Irvine
Workplace: OnsiteFull timeUSD 109,700 - 175,500 annuallyFunction: Program & Project Management (PMO)Experience: 6+ yearsEducation: mastersSkills: ["Stakeholder management","Leadership","Communication","Problem-solving","Team collaboration"]

Lead large-scale Advanced Packaging programs from greenfield factory construction to production ramp, coordinating R&D, manufacturing, EPC contractors, and vendors globally to hit milestones on time and within budget. Drive technology qualification and transfer to high-volume manufacturing, oversee tool procurement, integration, and yield optimization, and manage multi-billion-dollar CapEx/OpEx within regulatory and safety requirements.

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FursaFursa
Broadcom
Broadcom
2 months ago

Staff Program Manager - Advanced Packaging Technology

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Source: Company careers pageValidated by: Fursa AI
Last checked: 14 days agoStatus: Live

Job Summary

Lead large-scale Advanced Packaging programs from greenfield factory construction to production ramp, coordinating R&D, manufacturing, EPC contractors, and vendors globally to hit milestones on time and within budget. Drive technology qualification and transfer to high-volume manufacturing, oversee tool procurement, integration, and yield optimization, and manage multi-billion-dollar CapEx/OpEx within regulatory and safety requirements.
Location: Irvine
Workplace: Onsite
Employment Type: Full time
Job Function: Program & Project Management (PMO)

Key Responsibilities

  • •Technology Development and Transfer for Production: Achieve on time Technology Qualification, through collaborate with in-house and partner R&D teams developing disruptive technologies. Facilitate successful Technology Transfer from R&D into High Volume Manufacturing (HVM)
  • •Factory Construction: Coordinate greenfield construction of a very large scale advanced packaging manufacturing facility; Manage the EPC contractor and other local architectural, engineering, and sub-contractor firms to ensure strict timeline and safety compliance; Oversee compliance with local codes / requirements for land development, civil engineering, cleanroom construction, and facility hook-up; Report program status, budget variances, and milestone achievements directly to executive leadership
  • •Tool Procurement & Integration: Work with Factory and R&D Teams on Tool selection, procurement, logistics, and installation of next generation equipment for Heterogeneous Integration from global tier-one vendors; Coordinate complex international logistics to import highly sensitive tooling and materials; Oversee the hook-up, facility integration, and initial hardware qualification of all manufacturing lines
  • •Production Ramp & Yield Optimization: Partner with Factory & R&D teams and Tool vendors, for operational transition from tool qualification to HVM readiness; Accelerate yield learning curves and meet target defect-density metrics in collaboration with process engineering and quality teams; Manage manufacturing cycle time, line balancing, and factory automation deployment during the ramp phase; Establish SOPs and training pipelines to upscale the local workforce for stable production
  • •Financial & Local Regulatory Compliance: Manage multi-billion-dollar CapEx and OpEx budgets and cash flows, in collaboration with Finance teams; Ensure compliance with local Regulatory Agency requirements; Implement strict risk-mitigation frameworks to handle supply chain bottlenecks and labor market constraints

Pay and Benefits

Salary: USD 109,700 - 175,500 annually
Equity and Bonus:Equity

Key Requirements

  • •Master's degree in Engineering, Materials Science, or related STEM field. MBA preferred.
Experience:6+ yearsSemiconductorAdvanced packagingManufacturing
Education:Master's
Skills:Stakeholder managementLeadershipCommunicationProblem-solvingTeam collaboration
Certifications:PMPPgMP
Languages:English
Tech Stack:Primavera P6MS ProjectSPCLean manufacturingHeterogeneous Integration

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn