Staff Process Engineer, APTD Bonding

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Root-cause problem solving","Risk management","Data analysis","Leadership","Collaboration"]

Own start-up, development, and optimization of APTD bonding assembly processes to improve product quality and reliability. Drive yield/productivity gains, cost reduction, and risk management while troubleshooting manufacturing line issues. Diagnose and resolve assembly problems using failure analysis, FMEA, 8D, and SPC/FDC methods. Lead process/equipment/material evaluation and implement changes for new product introductions, including baseline validation and SPC/FDC/RMS/APC support.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Staff Process Engineer, APTD Bonding

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Own start-up, development, and optimization of APTD bonding assembly processes to improve product quality and reliability. Drive yield/productivity gains, cost reduction, and risk management while troubleshooting manufacturing line issues. Diagnose and resolve assembly problems using failure analysis, FMEA, 8D, and SPC/FDC methods. Lead process/equipment/material evaluation and implement changes for new product introductions, including baseline validation and SPC/FDC/RMS/APC support.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Develop new or modified process formulations, define equipment requirements/specifications, and review processing techniques and methods.
  • •Identify, diagnose, and resolve assembly process-related problems to improve yield and productivity.
  • •Coordinate process, equipment, and material evaluation/optimization initiatives and implement changes at process steps.
  • •Validate and fan out new process baselines qualified, including new processes, tools, and/or materials for new product introductions.
  • •Support SPC/FDC/RMS/APC and site-to-site portability; audit material suppliers for quality, cost, and risk management.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics plus 5 years of relevant industry experience.
  • •Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products.
  • •Experience with design of experiment (DOE) techniques, Statistical Process Control (SPC), and defect/data analysis.
  • •Experience in semiconductor process engineering and packaging with understanding of incoming/outgoing process and equipment interactions.
  • •Ability to resolve sophisticated issues using root-cause or model-based problem solving and adapt to shifting team needs.
Experience:5+ yearsSemiconductorsMemorySemiconductor packaging
Education:Bachelor's
Skills:Root-cause problem solvingRisk managementData analysisLeadershipCollaboration
Tech Stack:FMEA8DSPCFDCRMSAPCDOESPC/FDC

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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