Applied Materials

1 day ago

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 20 hours agoStatus: Live

Job Summary

Drive N+2 and beyond pathfinding for advanced packaging architectures as a senior individual contributor. Own hands-on feasibility studies and integration challenges for concepts such as D2W, RDL, CoWoS, TSV, and heterogeneous integration. Execute experiments, simulations, and validation vehicles, develop scaling and co-optimization frameworks, and communicate results to influence technology roadmap decisions. Partner with materials suppliers, OSATs, foundries, and research teams to de-risk new integration approaches and align with customer roadmaps.

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging and identify key inflection points in interconnect scaling, materials, and integration architectures.
•Lead hands-on development and feasibility studies for novel packaging concepts such as D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.
•Develop and validate new integration approaches, including mixed interconnect architectures, advanced bumping strategies, and next-gen substrates.
•Design and execute experiments, simulations, and test vehicles; build scaling frameworks and design–process co-optimization strategies for future performance, cost, and reliability.
•Engage stakeholders and ecosystem partners to translate customer/system trends into actionable technical problems and influence technology roadmap decisions; mentor junior engineers.

Travel: Low travel

Key Requirements

•10–15+ years of experience in semiconductor technology with strong exposure to advanced packaging and/or process integration.
•Demonstrated experience in technology development, pathfinding, or exploratory R&D.
•Strong understanding of advanced packaging technologies including RDL, TSV, CoWoS, and hybrid bonding.
•Ability to solve complex technical problems and translate concepts into experimental validation.
•Strong communication skills to articulate technical insights and business relevance.

Experience:10-15 yearsSemiconductorAdvanced packagingExploratory R&D

Education:Master's in Materials Science, Electrical Engineering, Mechanical Engineering, Physics (or related field)

Skills:Deep technical problem-solvingConcept-to-feasibility executionData-driven recommendationsTechnical communicationCollaboration

Tech Stack:Advanced packagingInterconnect scalingMaterialsIntegration architecturesD2WRDLCoWoSTSVHeterogeneous integrationMixed interconnect architecturesAdvanced bumping strategiesNext-gen substratesHybrid bondingChipletsAIHPCMemory integrationDesign–process co-optimizationSystem-level trade-offs

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

1 day ago

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 20 hours agoStatus: Live

Job Summary

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging and identify key inflection points in interconnect scaling, materials, and integration architectures.
•Lead hands-on development and feasibility studies for novel packaging concepts such as D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.
•Develop and validate new integration approaches, including mixed interconnect architectures, advanced bumping strategies, and next-gen substrates.
•Design and execute experiments, simulations, and test vehicles; build scaling frameworks and design–process co-optimization strategies for future performance, cost, and reliability.
•Engage stakeholders and ecosystem partners to translate customer/system trends into actionable technical problems and influence technology roadmap decisions; mentor junior engineers.

Travel: Low travel

Key Requirements

•10–15+ years of experience in semiconductor technology with strong exposure to advanced packaging and/or process integration.
•Demonstrated experience in technology development, pathfinding, or exploratory R&D.
•Strong understanding of advanced packaging technologies including RDL, TSV, CoWoS, and hybrid bonding.
•Ability to solve complex technical problems and translate concepts into experimental validation.
•Strong communication skills to articulate technical insights and business relevance.

Experience:10-15 yearsSemiconductorAdvanced packagingExploratory R&D

Education:Master's in Materials Science, Electrical Engineering, Mechanical Engineering, Physics (or related field)

Skills:Deep technical problem-solvingConcept-to-feasibility executionData-driven recommendationsTechnical communicationCollaboration

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor