PDE PIE (Package Integration Engineering) Engineer

Micron Technology
Malaysia
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Data analysis","Statistical analysis","Due diligence","Data-driven decision-making","Collaboration"]

Lead and manage NPI activities as a Product Owner, driving NPI phase gate reviews and coordinating product start-up to achieve first-pass qualification. Own the product life cycle from NPI through EOL, monitor yield trends and QDR/reliability, and provide timely support for engineering samples and hot lots. Partner with process/equipment/manufacturing owners to introduce packages into volume production and develop new technology capabilities ahead of market.

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Micron Technology
Micron Technology
3 days ago

PDE PIE (Package Integration Engineering) Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Lead and manage NPI activities as a Product Owner, driving NPI phase gate reviews and coordinating product start-up to achieve first-pass qualification. Own the product life cycle from NPI through EOL, monitor yield trends and QDR/reliability, and provide timely support for engineering samples and hot lots. Partner with process/equipment/manufacturing owners to introduce packages into volume production and develop new technology capabilities ahead of market.
Location: Malaysia
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Lead and manage NPI activities through NPI phase gate review with cross-functional teams.
  • •Coordinate new product start-up to achieve first-pass qualification and communicate timelines, applications, and customer requirements.
  • •Work with process/equipment/manufacturing/planning owners to bring new products and packages into volume production.
  • •Support first silicon, engineering samples, and qualified samples, including engineering hot lots cycle time per PDT schedule.
  • •Monitor yield trends and QDR/reliability, initiate early attention when needed, and own the product lifecycle from NPI to EOL.

Key Requirements

  • •Bachelor’s degree in an Engineering discipline (Mechanical, Material, Chemical, Electrical).
  • •Passion for backend engineering process or package development.
  • •Eager to learn component test and/or module manufacturing process knowledge.
  • •Understand semiconductor package structures and package reliability concepts.
  • •Proficient in JMP for analysis and strong statistical/data interpretation skills.
Experience:SemiconductorsManufacturing
Education:Bachelor's in Engineering
Skills:Data analysisStatistical analysisDue diligenceData-driven decision-makingCollaboration
Tech Stack:JMPAI assistant toolsCopilot

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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