Dry Etch module development engineer

Intel
United States
Workplace: HybridFull timeUSD 133,800 - 255,200 annuallyFunction: Product ManagementExperience: 4-8 yearsSkills: ["Root cause analysis","Problem-solving","Technical leadership","Mentoring","Communication"]

Develop and drive next-generation dry etch patterning processes for high-volume manufacturing and future technology. Partner with cross-functional teams to solve complex process and defect issues, lead root-cause and corrective actions, and run characterization plans and experiments (DOE/response surface). Establish and mature control systems (SPC, control plans, recipe governance) to sustain production performance, improve yield/reliability/cost, and transfer scalable solutions to manufacturing.

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Intel
Intel
1 month ago

Dry Etch module development engineer

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Job Summary

Develop and drive next-generation dry etch patterning processes for high-volume manufacturing and future technology. Partner with cross-functional teams to solve complex process and defect issues, lead root-cause and corrective actions, and run characterization plans and experiments (DOE/response surface). Establish and mature control systems (SPC, control plans, recipe governance) to sustain production performance, improve yield/reliability/cost, and transfer scalable solutions to manufacturing.
Location: United States
Workplace: Hybrid
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Drive technology development for high-volume manufacturing and future technology, including process integration and equipment solutions and feasibility studies.
  • •Own development of next-generation patterning processes (process architecture, optimization strategies, qualification methodologies).
  • •Lead cross-functional troubleshooting of complex process/defect issues using structured root-cause, containment, and permanent corrective actions.
  • •Design and execute characterization plans; plan and run experiments across the development cycle (DOE/response surface/robustness studies).
  • •Establish and mature control systems to optimize/sustain performance (SPC, control plans, alarms, response plans, recipe governance) and drive improvements in yield, reliability, cost, productivity, and process capability.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •PhD (4+ years) or Master’s (6+ years) or Bachelor’s (8+ years) in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor-related STEM field with dry etch industry experience at a leading foundry or equipment supplier.
  • •Hands-on dry etch semiconductor manufacturing experience, including ownership of process development and optimization.
  • •Strong plasma etch fundamentals knowledge (plasma generation, plasma-surface interactions, selectivity, profile control, defect mechanisms).
  • •Proven experience delivering dry etch process improvements for advanced technology nodes (yield, reliability, performance, manufacturability).
  • •Statistical analysis and DOE expertise using tools such as JMP, Python, or MATLAB to drive data-based decisions.
Experience:4-8 yearsSemiconductorsDry etchFoundryEquipment suppliers
Education:
Skills:Root cause analysisProblem-solvingTechnical leadershipMentoringCommunication
Tech Stack:Dry etchPlasma etchDOEResponse surfaceSPCControl plansRecipe governanceJMPPythonMATLABICPCCPHARCALESEMTEMCD SEMAFMXPSEUV

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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