Dry Etch module development engineer
Intel
United States
Workplace: HybridFull timeUSD 133,800 - 255,200 annuallyFunction: Product ManagementExperience: 4-8 yearsSkills: ["Root cause analysis","Problem-solving","Technical leadership","Mentoring","Communication"]Develop and drive next-generation dry etch patterning processes for high-volume manufacturing and future technology. Partner with cross-functional teams to solve complex process and defect issues, lead root-cause and corrective actions, and run characterization plans and experiments (DOE/response surface). Establish and mature control systems (SPC, control plans, recipe governance) to sustain production performance, improve yield/reliability/cost, and transfer scalable solutions to manufacturing.

