Broadcom

2 months ago

R&D Engineer IC Design

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 hours agoStatus: Live

Job Summary

Join Broadcom as an IC Design R&D Engineer focusing on physical design of chips from netlist to GDSII. You will lead floorplanning, partitioning, and block pin assignments, perform PnR and timing closure, and conduct block IR/EM analysis. Proficiency in scripting (Python, Tcl, Perl) and Calibre-based verification is expected; experience in low-power design is a plus.

Location: Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

•Work as part of a physical design team implementing chips from netlist to GDSII with understanding of technology elements and design flow in all stages.
•Responsible for floorplanning, design partition and block pin assignment.
•Perform blocks PnR, timing closure, physical verification.
•Perform blocks IR/EM analysis; chip level IR/EM analysis is a big plus.
•Familiar with scripting languages such as Tcl, Perl and Python; write scripts to automate physical design flow and make it more efficient.

Pay and Benefits

Salary: USD 108,000 - 172,800

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEsppPaid HolidaysPaid Leave

Key Requirements

•Bachelor’s degree and 8+ years of related experience or Master’s degree with 6+ years of experience.
•Experience with floorplanning, design partition, and block pin assignment.
•Perform blocks PnR, timing closure, physical verification.
•Perform blocks IR/EM analysis; chip level IR/EM analysis is a big plus.
•Familiar with scripting languages such as Tcl, Perl and Python; write scripts to automate physical design flow.

Experience:8+ yearsSemiconductorHardware

Education:Bachelor's

Skills:TCLPerlPythonCalibreGDSIIFloorplanningTiming closure

Tech Stack:TCLPerlPythonCalibreGDSII

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

2 months ago

R&D Engineer IC Design

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 hours agoStatus: Live

Job Summary

Location: Irvine

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

•Work as part of a physical design team implementing chips from netlist to GDSII with understanding of technology elements and design flow in all stages.
•Responsible for floorplanning, design partition and block pin assignment.
•Perform blocks PnR, timing closure, physical verification.
•Perform blocks IR/EM analysis; chip level IR/EM analysis is a big plus.
•Familiar with scripting languages such as Tcl, Perl and Python; write scripts to automate physical design flow and make it more efficient.

Pay and Benefits

Salary: USD 108,000 - 172,800

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEsppPaid HolidaysPaid Leave

Key Requirements

•Bachelor’s degree and 8+ years of related experience or Master’s degree with 6+ years of experience.
•Experience with floorplanning, design partition, and block pin assignment.
•Perform blocks PnR, timing closure, physical verification.
•Perform blocks IR/EM analysis; chip level IR/EM analysis is a big plus.
•Familiar with scripting languages such as Tcl, Perl and Python; write scripts to automate physical design flow.

Experience:8+ yearsSemiconductorHardware

Education:Bachelor's

Skills:TCLPerlPythonCalibreGDSIIFloorplanningTiming closure

Tech Stack:TCLPerlPythonCalibreGDSII

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn