Principal Physical Design

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Experience: 8+ yearsEducation: mastersSkills: ["Technical leadership","Mentoring","Problem-solving","Collaboration","Communication"]

Provide technical leadership for advanced DRAM digital ASIC physical design implementation and signoff. Drive physical design execution from RTL through tapeout, focusing on timing closure, power integrity, EMIR analysis, and design reliability. Collaborate across architecture, RTL, implementation, CAD, and technology teams to deliver scalable physical design solutions meeting PPA and reliability targets, while innovating methodologies, mentoring engineers, and influencing the future physical design roadmap.

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Micron Technology
Micron Technology
4 weeks ago

Principal Physical Design

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Job Summary

Provide technical leadership for advanced DRAM digital ASIC physical design implementation and signoff. Drive physical design execution from RTL through tapeout, focusing on timing closure, power integrity, EMIR analysis, and design reliability. Collaborate across architecture, RTL, implementation, CAD, and technology teams to deliver scalable physical design solutions meeting PPA and reliability targets, while innovating methodologies, mentoring engineers, and influencing the future physical design roadmap.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Lead physical design implementation of complex DRAM digital designs, including floorplanning, place and route, clock tree synthesis, timing closure, and tapeout activities.
  • •Drive power integrity strategies and signoff methodologies, including PDN planning, IR drop analysis, EM verification, and EMIR signoff.
  • •Collaborate with multi-functional teams to resolve timing, congestion, power, signal integrity, and reliability challenges at block and full-chip levels.
  • •Develop and deploy methodology improvements, automation solutions, and guidelines to improve build quality, efficiency, and scalability.
  • •Mentor engineers and provide technical leadership while influencing future memory products through physical design and signoff methodology innovation.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Master’s degree in Electrical Engineering (or equivalent) with 8+ years of experience, or Bachelor’s degree with 10+ years of experience in ASIC physical design.
  • •Strong expertise in physical design implementation flows including floorplanning, place and route, clock tree synthesis, timing closure, and design signoff.
  • •Hands-on experience with STA, signal integrity, power integrity, physical verification, and advanced process technologies.
  • •Proficiency with industry physical design and signoff tools such as Synopsys IC Compiler II (ICC2), Fusion Compiler, PrimeTime, PrimePower, and RedHawk (or equivalent).
  • •Strong scripting and automation skills using Python, Tcl, or similar languages.
Experience:8+ yearsASICDRAMSemiconductor
Education:Master's in Electrical Engineering
Skills:Technical leadershipMentoringProblem-solvingCollaborationCommunication
Tech Stack:Synopsys IC Compiler II (ICC2)Fusion CompilerPrimeTimePrimePowerRedHawkPythonTclSTAIR drop analysisElectromigration (EM)EMIR signoffPDN planning

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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