ENGINEER, APTD Wafer Thinning / CMP process

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2+ yearsEducation: mastersSkills: ["Innovative mindset","Independent thinking","Teamwork","Motivation","Communication"]

Improve wafer thinning and CMP process performance by coordinating experiments for technology development and yield improvement. Troubleshoot complex process issues using root-cause analysis, and support on-site project execution as a technical consultant. Contribute to advanced packaging R&D (chip stacking and 2.5D/3D), including mechanical characterization, testing, and data review. Prepare technical reports and presentations and collaborate across teams and global sites.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

ENGINEER, APTD Wafer Thinning / CMP process

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Improve wafer thinning and CMP process performance by coordinating experiments for technology development and yield improvement. Troubleshoot complex process issues using root-cause analysis, and support on-site project execution as a technical consultant. Contribute to advanced packaging R&D (chip stacking and 2.5D/3D), including mechanical characterization, testing, and data review. Prepare technical reports and presentations and collaborate across teams and global sites.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive improvements in wafer thinning and CMP process performance.
  • •Coordinate experiments for technology development and yield improvement.
  • •Assist advanced packaging R&D (chip stacking, 2.5D or 3D).
  • •Support on-site project execution and make technical decisions as a consultant.
  • •Troubleshoot complex problems, perform root cause analysis, and resolve process engineering issues.

Key Requirements

  • •More than 2 years of experience in the semiconductor industry.
  • •Master’s (PhD plus) in Chemistry, Physics, Materials, or related engineering science fields.
  • •Experience with Si grinding, Edge Trim, Si CMP, Cu CMP, and/or Oxide CMP technologies.
  • •Understanding of CMP metrics including planarity, RR, selectivity, dishing, erosion, surface roughness, and defectivity.
  • •Fluent communication in both English and Chinese, with a strong independent and team mindset.
Experience:2+ yearsSemiconductorCMPAdvanced packaging
Education:Master's in Chemistry, Physic, Material, engineering science related fields
Skills:Innovative mindsetIndependent thinkingTeamworkMotivationCommunication
Languages:EnglishChinese
Tech Stack:Wafer thinningCMPSi grindingEdge TrimSi CMPCu CMPOxide CMPPlanarityRRSelectivityDishingErosionSurface roughnessDefectivityRoot cause analysisMaterials characterization

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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