3 days ago

Package Design Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Own end-to-end ASIC package design for complex flip-chip BGA structures, covering signal integrity, power integrity, thermal, reliability, and manufacturability. Collaborate within a worldwide R&D team to design critical SerDes, 5G RF/Microwave ADC/DAC, HBM, and DDR5 package elements, perform physical (layout) work, and manage priorities across multiple projects while partnering on customer interfaces and process efficiency improvements.

Location: San Jose, Austin

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Mid level

Key Responsibilities

•Lead overall ASIC package design responsibility, including signal integrity, power integrity, manufacturability, reliability, and thermal aspects.
•Design critical package structures for SerDes, ADC/DAC, DDR, and related components.
•Schedule, prioritize, and track work across 2+ projects simultaneously.
•Perform general flip-chip BGA package design and engineering work.
•Drive efficiency improvements through process development, automation, and documentation.

Pay and Benefits

Salary: USD 121,900 - 195,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityPaid HolidaysPaid LeaveEsppEap

Key Requirements

•BSEE (or similar) with 8+ years of flip-chip-BGA package design experience, or MSEE (or similar) with 6+ years experience.
•Knowledge of package-level signal integrity and power integrity to apply to package designs.
•Preferred experience with Cadence APD (Allegro Package Designer) or an equivalent tool.
•Experience working across multiple projects while self-managing and organizing your work.
•Cooperate with worldwide teams (multiple time zones) and perform co-design with internal and external (vendor) designers.

Experience:8+ yearsASICsFlip-chip packagingHigh-speed SerDes5GHPCAI networking

Education:Bachelor's

Skills:Self-managementOrganizationCollaborationProject prioritizationProcess improvement

Tech Stack:Cadence APDAllegro Package DesignerCadence SKILLFlip-chip BGASerDesADC/DACHBMDDR5

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

3 days ago

Package Design Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Location: San Jose, Austin

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Mid level

Key Responsibilities

•Lead overall ASIC package design responsibility, including signal integrity, power integrity, manufacturability, reliability, and thermal aspects.
•Design critical package structures for SerDes, ADC/DAC, DDR, and related components.
•Schedule, prioritize, and track work across 2+ projects simultaneously.
•Perform general flip-chip BGA package design and engineering work.
•Drive efficiency improvements through process development, automation, and documentation.

Pay and Benefits

Salary: USD 121,900 - 195,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityPaid HolidaysPaid LeaveEsppEap

Key Requirements

•BSEE (or similar) with 8+ years of flip-chip-BGA package design experience, or MSEE (or similar) with 6+ years experience.
•Knowledge of package-level signal integrity and power integrity to apply to package designs.
•Preferred experience with Cadence APD (Allegro Package Designer) or an equivalent tool.
•Experience working across multiple projects while self-managing and organizing your work.
•Cooperate with worldwide teams (multiple time zones) and perform co-design with internal and external (vendor) designers.

Experience:8+ yearsASICsFlip-chip packagingHigh-speed SerDes5GHPCAI networking

Education:Bachelor's

Skills:Self-managementOrganizationCollaborationProject prioritizationProcess improvement

Tech Stack:Cadence APDAllegro Package DesignerCadence SKILLFlip-chip BGASerDesADC/DACHBMDDR5

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn