SpaceX

5 months ago

Die Bonding Specialist, Silicon Assembly (Starlink)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 21 hours agoStatus: Live

Job Summary

Manufacturing-focused Die Bonding Specialist driving high-precision bonding processes in Starlink silicon assembly. Works with IC packaging engineers and cross-functional teams to optimize bond quality, yield, and process reliability in a fast-paced cleanroom environment, supporting new die sizes and NPI for advanced packaging.

Location: Texas

Workplace: Onsite

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Key Responsibilities

•Operate and program die bonding equipment to achieve accurate die placement with micron-level precision and minimal tilt
•Develop and optimize bonding recipes by adjusting dispense volume, cure temperature, pressure, and reflow profiles for void-free bonds and thermal reliability
•Perform in-process inspections using C-SAM, X-ray imaging, and shear testers to evaluate bond quality and defect rates
•Troubleshoot process variations, equipment downtime, and material incompatibilities via root cause analysis and corrective actions to improve cycle time and first-pass yield
•Collaborate with engineers to integrate die bonding into the full packaging flow and support qualifications for new die sizes, substrates, or new product introduction (NPI) for advanced packaging formats

Key Requirements

•High school diploma or equivalency certificate; OR bachelor’s degree in an engineering, math or science discipline
•3+ years of professional experience in a hands-on manufacturing environment; OR bachelor’s degree in an engineering, math or science discipline
•6+ years of hands-on experience in semiconductor die bonding or die attach processes within a packaging or assembly environment
•Proficiency with die bonding techniques, including conductive adhesives, solder reflow, and ultrasonic methods, with knowledge of material interactions and thermal management
•Familiarity with data analysis and process control tools (e.g., Excel, SPC software) for yield tracking and variability reduction

Experience:3-6 yearsSemiconductorManufacturing

Education:Bachelor's in engineering, math or science

Skills:Problem-solvingAttention to detailTeamworkQuality focusSafety consciousness

Certifications:SEMIIPC

Languages:English

Tech Stack:ExcelSPCDOEC-SAMX-ray

Company Brief

SpaceX

Designs, manufactures, and launches advanced rockets and spacecraft for commercial and government customers, aiming to reduce space transportation costs and enable human life on Mars through reusable launch vehicles and integrated space systems.

Industry: Aerospace Manufacturing

Company Size: Enterprise (1,001+ employees)

Growth: Established Company

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: Hawthorne, United States

Founded: 2002

Glassdoor: 4.2

Website LinkedIn

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SpaceX

5 months ago

Die Bonding Specialist, Silicon Assembly (Starlink)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 21 hours agoStatus: Live

Job Summary

Location: Texas

Workplace: Onsite

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Key Responsibilities

•Operate and program die bonding equipment to achieve accurate die placement with micron-level precision and minimal tilt
•Develop and optimize bonding recipes by adjusting dispense volume, cure temperature, pressure, and reflow profiles for void-free bonds and thermal reliability
•Perform in-process inspections using C-SAM, X-ray imaging, and shear testers to evaluate bond quality and defect rates
•Troubleshoot process variations, equipment downtime, and material incompatibilities via root cause analysis and corrective actions to improve cycle time and first-pass yield
•Collaborate with engineers to integrate die bonding into the full packaging flow and support qualifications for new die sizes, substrates, or new product introduction (NPI) for advanced packaging formats

Key Requirements

•High school diploma or equivalency certificate; OR bachelor’s degree in an engineering, math or science discipline
•3+ years of professional experience in a hands-on manufacturing environment; OR bachelor’s degree in an engineering, math or science discipline
•6+ years of hands-on experience in semiconductor die bonding or die attach processes within a packaging or assembly environment
•Proficiency with die bonding techniques, including conductive adhesives, solder reflow, and ultrasonic methods, with knowledge of material interactions and thermal management
•Familiarity with data analysis and process control tools (e.g., Excel, SPC software) for yield tracking and variability reduction

Experience:3-6 yearsSemiconductorManufacturing

Education:Bachelor's in engineering, math or science

Skills:Problem-solvingAttention to detailTeamworkQuality focusSafety consciousness

Certifications:SEMIIPC

Languages:English

Tech Stack:ExcelSPCDOEC-SAMX-ray

Company Brief

SpaceX

Industry: Aerospace Manufacturing

Company Size: Enterprise (1,001+ employees)

Growth: Established Company

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: Hawthorne, United States

Founded: 2002

Glassdoor: 4.2

Website LinkedIn