ASIC Package Design Manager

Broadcom
Colorado
Workplace: OnsiteFull timeUSD 143,800 - 230,000 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 12+ yearsEducation: bachelorsSkills: ["Self-management","Organization","Communication","Cross-functional collaboration","Team leadership"]

Lead an engineering team to design complex flip-chip-BGA ASIC packages for high-speed SerDes and very-high-power-delivery applications. Own project management for 20+ concurrent package designs, develop technical methodologies and package design rules, and coordinate customer, vendor, and cross-functional collaboration across a worldwide R&D organization. Contribute to technical efforts spanning SI/PI, simulations and extractions, DFx tradeoffs, and mechanical/thermal modeling for AI, networking, HPC, and 5G base station workloads.

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FursaFursa
Broadcom
Broadcom
1 month ago

ASIC Package Design Manager

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live
Reposted: similar role first listed 4 weeks ago

Job Summary

Lead an engineering team to design complex flip-chip-BGA ASIC packages for high-speed SerDes and very-high-power-delivery applications. Own project management for 20+ concurrent package designs, develop technical methodologies and package design rules, and coordinate customer, vendor, and cross-functional collaboration across a worldwide R&D organization. Contribute to technical efforts spanning SI/PI, simulations and extractions, DFx tradeoffs, and mechanical/thermal modeling for AI, networking, HPC, and 5G base station workloads.
Location: Colorado
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Manager level

Key Responsibilities

  • •Lead and support a team of engineers designing complex flip-chip-BGA packages for high-speed SerDes and very-high-power-delivery ASICs.
  • •Create and track project plans for 20+ concurrent package designs, managing scope, schedules, and resources.
  • •Organize team and customer activities to keep projects on track, and communicate status, next steps, and risks.
  • •Develop technical methodologies and steering package technology and design rules with team input.
  • •Collaborate with customers, vendors, and cross-functional partners on package design execution and requirements.
Travel: Low travel

Pay and Benefits

Salary: USD 143,800 - 230,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kEquityEmployee AssistancePaid HolidaysPaid Leave

Key Requirements

  • •Preferred experience managing people and projects.
  • •BSEE/MSEE (or similar) plus 12+ years of flip-chip-BGA package design experience, including high-speed SerDes, with at least 3 years in management.
  • •Knowledge of package-level signal integrity and power integrity to apply to package designs.
  • •Experience collaborating with a worldwide team across multiple time zones, including co-design with internal and vendor designers.
  • •Technical understanding of the package-design lifecycle, design data (e.g., .mcm, package spreadsheet, drawings), DFx tradeoffs, layout, SI/PI extractions and simulations, and automation code development.
Experience:12+ years
Education:Bachelor's in Electrical Engineering
Skills:Self-managementOrganizationCommunicationCross-functional collaborationTeam leadership
Tech Stack:Flip-chip-BGAASIC packagingSerDes448G5G RFMicrowave ADCMicrowave DACHBMDDR5SI/PISignal integrityPower integritySI/PI extractionsSimulationsDFxManufacturabilityReliabilityAssurance of supplyLayoutAutomation code development

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn