C2C Bonding Engineer

Samsung
Austin
Workplace: OnsiteFull timeUSD 131,000 - 206,000 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Project leadership","Root-cause problem solving","Risk assessment","Failure modeling","Process integration mindset"]

Lead the development, optimization, and manufacturing integration of copper-to-copper (C2C) wafer bonding technologies for next-generation CMOS image sensors. Own module integration for bonding and farBEOL steps, drive systematic yield and reliability improvements, and manage dimension targeting and variation control. Review and assess process changes across the factory via change control, and provide yield risk assessment and failure modeling for material review board incidents.

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FursaFursa
Samsung
Samsung
1 day ago

C2C Bonding Engineer

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Last checked: 57 minutes agoStatus: Live

Job Summary

Lead the development, optimization, and manufacturing integration of copper-to-copper (C2C) wafer bonding technologies for next-generation CMOS image sensors. Own module integration for bonding and farBEOL steps, drive systematic yield and reliability improvements, and manage dimension targeting and variation control. Review and assess process changes across the factory via change control, and provide yield risk assessment and failure modeling for material review board incidents.
Location: Austin
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Own module integration for C2C bonding and farBEOL steps within the process flow to enable a first-of-a-kind bonding process at Samsung Austin.
  • •Take ownership of systematic yield and reliability issues for these process steps and lead efforts to cure them via technology improvements and/or improved detection.
  • •Manage critical dimension targeting and variation control within the module.
  • •Review yield, cost, and throughput process changes across the factory through the Change Control Board.
  • •Provide yield risk assessment and failure modeling for factory incidents at the Material Review Board.

Pay and Benefits

Salary: USD 131,000 - 206,000 annually
Perks:Health InsuranceDentalVisionLife Insurance401kParental LeavePaid LeaveWellness StipendOnsite CafeGym Membership

Key Requirements

  • •Bachelor’s degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or related field.
  • •5+ years of experience in farBEOL process/module integration in semiconductor manufacturing plus 3+ years of bonding experience (10+ years preferred).
  • •Expert understanding of the overall process flow and how interactions drive yield, product performance, and reliability.
  • •Prior knowledge of fab unit processes including lithography, etch, diffusion, thin-film deposition, wet cleans, and CMP (highly preferred).
  • •Demonstrated ability to manage systematic yield/reliability issues through technology improvements and better detection.
Experience:5+ yearsSemiconductor manufacturingCMOS image sensors
Education:Bachelor's
Skills:Project leadershipRoot-cause problem solvingRisk assessmentFailure modelingProcess integration mindset
Tech Stack:Copper-to-copper bondingC2C bondingHybrid bondingWafer bondingFarBEOLModule integrationYieldReliabilityLithographyEtchDiffusionThin films depositionWet cleansCMPChange control boardMaterial review boardStacked image sensors

Company Brief

Samsung
Global conglomerate known for consumer electronics, home appliances, semiconductors, displays, and mobile devices. Designs and manufactures a wide range of products and solutions for consumers, enterprises, and industrial customers worldwide.
Industry: Conglomerates & Holding Companies
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Seoul, South Korea
Founded: 1938
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Glassdoor: 3.7
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