Advanced Package Design Engineer
AMD
San Jose
Workplace: OnsiteFull timeUSD 203,000 - 348,000 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 10+ yearsEducation: bachelorsSkills: ["Communication","Interpersonal skills","Collaboration","Data analysis","Problem-solving"]Evaluate and enable advanced 2.5D and 3D IC packaging technologies for FPGA and ASIC products, from early concept through production. Define 3DIC and package technology approaches and co-optimize system-technology for advanced nodes. Collaborate with design, CAD, and PDK teams to deliver robust 3DIC product and substrate designs, develop CAD/verification flows, manage design data for tape-out, and coordinate testchip validation and reliability assessment.
