Staff Process Engineer, Advanced Packaging CMP

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Communication","Risk management","Problem-solving","Cross-functional collaboration"]

Lead start-up, development, and optimization of advanced packaging CMP processes to improve product quality and reliability. Drive process yield improvement, cost reduction, productivity gains, and risk management while resolving manufacturing line issues. Use failure analysis, FMEA, 8D, and SPC/FDC to diagnose and correct assembly process problems, build advanced process monitoring/control methods, and partner with internal teams and vendors globally.

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Micron Technology
Micron Technology
1 week ago

Staff Process Engineer, Advanced Packaging CMP

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 days agoStatus: Live

Job Summary

Lead start-up, development, and optimization of advanced packaging CMP processes to improve product quality and reliability. Drive process yield improvement, cost reduction, productivity gains, and risk management while resolving manufacturing line issues. Use failure analysis, FMEA, 8D, and SPC/FDC to diagnose and correct assembly process problems, build advanced process monitoring/control methods, and partner with internal teams and vendors globally.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Start up, develop, and optimize CMP processes to improve product quality and reliability.
  • •Drive process yield improvement, cost reduction, productivity improvement, and risk management, including resolving manufacturing line problems.
  • •Identify, diagnose, and resolve assembly process problems using failure analysis, FMEA, 8D, and SPC/FDC methodology.
  • •Conduct fundamental research, consumables development, and hardware evaluation, and develop test processes for novel applications.
  • •Initiate and lead complex, multi-functional projects and serve as a technical advisory on significant technical issues, including supporting innovation via patents/technical papers.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Time-offPaid Holidays

Key Requirements

  • •BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics with 5+ years of CMP experience in the semiconductor industry.
  • •Hands-on experience operating CMP equipment such as AMAT (LKP), EBARA-300X, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
  • •Experience with dielectrics/metals CMP process development for Advanced Packaging or other semiconductor technologies.
  • •Understanding of integration/structural impacts and constraints across upstream/downstream processes including film deposition.
  • •Strong oral and written communication skills to convey technical concepts concisely and effectively.
Experience:5+ yearsSemiconductor industry
Education:Bachelor's in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics
Skills:CommunicationRisk managementProblem-solvingCross-functional collaboration
Tech Stack:Chemical Mechanical Planarization (CMP)Advanced PackagingAMAT (LKP)EBARA-300XOptical metrologyProfilometryPolishing slurriesConditionersPolishing padsFailure analysisFMEA8DSPCFDCProcess monitoringProcess controlDielectrics/metals CMPFilm depositionAI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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