ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 4-8 yearsSkills: ["Independent execution","Cross-functional collaboration","Project management","Model-based problem solving","Data-driven analysis"]

Own process development and integration schemes for HBM device applications within Micron’s Advanced Packaging Technology Development group. Develop unit processes that meet product and device requirements, drive yield and quality improvements, and analyze real-time yield/defects with inline WIP control and escalation. Lead integration processes from concept through high-volume production while collaborating across defect, probe testing, and process module teams, including automation to improve reporting and issue resolution.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION

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Last checked: 18 hours agoStatus: Live

Job Summary

Own process development and integration schemes for HBM device applications within Micron’s Advanced Packaging Technology Development group. Develop unit processes that meet product and device requirements, drive yield and quality improvements, and analyze real-time yield/defects with inline WIP control and escalation. Lead integration processes from concept through high-volume production while collaborating across defect, probe testing, and process module teams, including automation to improve reporting and issue resolution.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive yield and quality improvement for HBM products to support product milestone deliverables.
  • •Develop and lead integration processes from conceptual phase through high-volume production for complex package development challenges.
  • •Collaborate with cross-functional teams including defect, probe testing, and process module teams.
  • •Work independently across multiple projects within the APTD team.
  • •Drive automation, including creating AI agents to improve routine yield reporting and issue resolution efficiency.

Key Requirements

  • •Comprehensive understanding of HBM package structure and process flow.
  • •Experience with integrated failure mode and process change business process.
  • •Ability to manage projects to meet goals on time.
  • •Model-based problem-solving experience.
  • •Knowledge of DOE establishment and analysis.
Experience:4-8 yearsSemiconductorHBMAdvanced packaging
Skills:Independent executionCross-functional collaborationProject managementModel-based problem solvingData-driven analysis
Tech Stack:JMPXMobaYield cube3KlayoutSPC

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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