Front End Central Product Integration (FE CPIE) MTS (FE)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 7+ yearsSkills: ["Logical thinking","Data-driven decision making","Root cause analysis","Organizational skills","Collaboration"]

Own end-to-end process integration for front-end central product integration, ensuring structural uniformity and cross-loop alignment across critical modules such as the capacitance loop. Drive physics- and process-based integration strategies to close yield, quality, and reliability gaps, using model-based root-cause analysis and strengthening inline monitoring/defense lines. Lead global technical alignment, shift-left integration, and program execution across node transitions to improve whole-wafer yield and ramp performance.

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Micron Technology
Micron Technology
1 month ago

Front End Central Product Integration (FE CPIE) MTS (FE)

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Last checked: 7 hours agoStatus: Live

Job Summary

Own end-to-end process integration for front-end central product integration, ensuring structural uniformity and cross-loop alignment across critical modules such as the capacitance loop. Drive physics- and process-based integration strategies to close yield, quality, and reliability gaps, using model-based root-cause analysis and strengthening inline monitoring/defense lines. Lead global technical alignment, shift-left integration, and program execution across node transitions to improve whole-wafer yield and ramp performance.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead process integration (PI) structural uniformity and cross-loop integration for critical modules, owning end-to-end integration strategies to resolve yield, quality, and reliability gaps.
  • •Develop and drive physics- and process-based integration solutions with cross-module process owners, PI SMEs, and suppliers to achieve BIC yield and quality targets.
  • •Create and apply model-based root-cause analysis frameworks to diagnose structural non-uniformity using transport, reaction kinetics, pattern density, and geometry-dependent effects.
  • •Define, implement, and continuously strengthen critical inline monitoring and defense lines (e.g., CD, film loss, mass delta, defectivity, edge/periphery metrics) for robust control of structural uniformity.
  • •Drive shift-left integration and worldwide technical alignment by leading global projects, standardizing network BKMs, scaling solutions across sites, and improving benchmark performance and cycle time.
Travel: Medium travel

Key Requirements

  • •BS/MS/PhD in EE, Materials Engineering/Science, Physics, or Chemical (or 10+ years in a process-related semiconductor role).
  • •7+ years of relevant semiconductor industry experience and knowledge of semiconductor fabrication process flows and how changes affect yield, device performance, and reliability.
  • •Understanding of DRAM and NAND operation/structure to interpret parametric, probe, and qual data across front-end and backend assembly processes.
  • •Strong model-based problem solving with data-driven decision making, presentation skills, and proven ability to troubleshoot structural and device-related issues with root-cause resolution.
  • •Ability to organize work effectively, take initiative, multitask, and collaborate across teams and suppliers; travel to Micron sites as necessary.
Experience:7+ yearsSemiconductor industryDRAMNANDProcess integration
Education:
Skills:Logical thinkingData-driven decision makingRoot cause analysisOrganizational skillsCollaboration

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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