Product Development Engineer – Thermal Engineering

AMD
Austin
Workplace: HybridFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Analytical","Troubleshooting","Communication","Collaboration","Ownership"]

Serve as a thermal SME within advanced packaging and New Product Introduction (NPI), driving thermal characterization, validation, and technology development for next-generation semiconductor products. Lead Thermal Test Vehicle (TTV) development, testing, data analysis, and validation; build and correlate thermal models with lab measurements. Partner across package design, reliability, manufacturing, test, and product engineering to assess thermal performance, resolve issues via root-cause analysis, and support qualification, product bring-up, and production ramps with OSAT partners.

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FursaFursa
AMD
AMD
1 month ago

Product Development Engineer – Thermal Engineering

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Serve as a thermal SME within advanced packaging and New Product Introduction (NPI), driving thermal characterization, validation, and technology development for next-generation semiconductor products. Lead Thermal Test Vehicle (TTV) development, testing, data analysis, and validation; build and correlate thermal models with lab measurements. Partner across package design, reliability, manufacturing, test, and product engineering to assess thermal performance, resolve issues via root-cause analysis, and support qualification, product bring-up, and production ramps with OSAT partners.
Location: Austin
Workplace: Hybrid
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Serve as the thermal SME for advanced packaging technology development and NPI programs.
  • •Lead thermal characterization activities, including TTV development, testing, data analysis, and validation.
  • •Develop thermal models and correlate simulation results with laboratory measurements.
  • •Partner with cross-functional teams to assess thermal performance, identify risks, and implement solutions.
  • •Support qualification, product bring-up, manufacturing transfers, and production activities with OSAT partners.

Key Requirements

  • •Experience in thermal engineering within semiconductor, electronics, data center, or advanced packaging environments.
  • •Strong understanding of heat transfer principles and thermal management techniques.
  • •Experience with Thermal Test Vehicles (TTVs), thermal characterization, and laboratory testing.
  • •Familiarity with thermal modeling, simulation correlation, and data analysis.
  • •Bachelor's degree preferred in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or a related discipline.
Experience:SemiconductorElectronicsData centerAdvanced packaging
Education:Bachelor's in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or related engineering discipline
Skills:AnalyticalTroubleshootingCommunicationCollaborationOwnership
Languages:En-us

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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