Lead Application Engineer

Cadence Design Systems
Washington
Workplace: RemoteFull timeUSD 92,400 - 171,600 annuallyFunction: Administration & Executive AssistanceExperience: 15+ yearsEducation: bachelorsSkills: ["Continuous learning","Customer-facing communication","Problem-solving","Technical leadership","Effective collaboration"]

Define and lead the development of advanced packaging and 3DIC analysis flows to support foundry and customer solutions. Use expert knowledge of Cadence (or equivalent) SI/PI toolsets and advanced packaging concepts to address high-speed signal design, power design, signal/power integrity, electromagnetics, thermal, and RF constraints. Provide technical leadership across projects, evaluate customer environments, anticipate issues, and collaborate with R&D, Product Engineering, Marketing, and customers to drive customer success.

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Cadence Design Systems
Cadence Design Systems
3 days ago

Lead Application Engineer

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Last checked: 3 hours agoStatus: Live

Job Summary

Define and lead the development of advanced packaging and 3DIC analysis flows to support foundry and customer solutions. Use expert knowledge of Cadence (or equivalent) SI/PI toolsets and advanced packaging concepts to address high-speed signal design, power design, signal/power integrity, electromagnetics, thermal, and RF constraints. Provide technical leadership across projects, evaluate customer environments, anticipate issues, and collaborate with R&D, Product Engineering, Marketing, and customers to drive customer success.
Location: Washington
Workplace: Remote
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Define and lead development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.
  • •Apply expert knowledge of SI/PI toolsets to multiple analysis flows, including high-speed signal design, power design, and integrity constraints.
  • •Analyze customer environments, evaluate appropriate solutions, and stay aware of competitive technologies.
  • •Anticipate technical issues and develop creative solutions before problems occur.
  • •Provide technical leadership across a wide range of projects and collaborate with internal teams and customers.

Pay and Benefits

Salary: USD 92,400 - 171,600 annually
Equity and Bonus:Equity
Perks:Paid Leave401kHealth InsuranceDentalVisionEquity

Key Requirements

  • •Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering.
  • •Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design.
  • •5+ years experience with Cadence SI/PI tools including Allegro platform tools such as Sigrity, Clarity, PCB Editor, and ICP.
  • •Strong knowledge of advanced packaging concepts including 2.5D, 3DIC, and stacked die technologies.
  • •Strong customer-facing communication and problem-solving skills with excellent verbal and written communication.
Experience:15+ yearsSemiconductorsIC packagingPCB design
Education:Bachelor's in Electrical or Electronics Engineering
Skills:Continuous learningCustomer-facing communicationProblem-solvingTechnical leadershipEffective collaboration
Tech Stack:CadenceAllegro platformSigrityClarityPCB EditorICPSignal IntegrityPower IntegrityElectromagneticsThermal analysisRF2.5D3DICStacked dieHigh-speed signal designPower designSignal integrityPower integrity

Company Brief

Cadence Design Systems
Provides electronic design automation (EDA) software, IP, and services for semiconductor and systems companies to design, verify, and implement integrated circuits, systems-on-chip, and electronic systems across industries including communications, automotive, and consumer electronics.
Industry: Developer Tools
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1988
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