Foundry 3D Packaging Engineer

AMD
Austin
Workplace: HybridFull timeUSD 127,190 - 218,040 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: phdSkills: ["Communication","Problem solving","Organizational skills","Interpersonal skills","Presentation skills"]

Drive technology development of advanced 3D package architectures within the Advanced Packaging team. Execute and coordinate proof of concepts, support product bring-up, and improve yield and reliability to meet performance, cost, and schedule targets. Define FMEA, TV design, DFM/DFY, and manage DOE for material selections and process window validation. Partner with internal teams and ecosystem partners to transfer new packaging processes from concept through NPI and mass production.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
AMD
AMD
2 days ago

Foundry 3D Packaging Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Drive technology development of advanced 3D package architectures within the Advanced Packaging team. Execute and coordinate proof of concepts, support product bring-up, and improve yield and reliability to meet performance, cost, and schedule targets. Define FMEA, TV design, DFM/DFY, and manage DOE for material selections and process window validation. Partner with internal teams and ecosystem partners to transfer new packaging processes from concept through NPI and mass production.
Location: Austin
Workplace: Hybrid
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Define FMEA, TV design, DFM, and DFY for advanced 3D package architectures.
  • •Plan and execute DOE for material selections and process window validation.
  • •Define quality and reliability tests, including defect detection and FA methodology.
  • •Partner with architects, designers, and product owners to develop high-yield, cost-effective solutions and transfer to high-volume manufacturing.
  • •Lead process optimization and drive yield and reliability improvement from concept through NPI and mass production with ecosystem partners.

Pay and Benefits

Salary: USD 127,190 - 218,040 annually

Key Requirements

  • •Proven experience in wafer process integration, including BEOL integration, 3D integration with TSV, and hybrid bonding (CoW and W2W).
  • •Hands-on process bring-up and development experience, with strong oral and written communication skills.
  • •Knowledge of BEOL process, TSV integration, and hybrid bonding, including defect metrology experience.
  • •Strong knowledge in design and reliability (e.g., TV design, CPI, thermo-mechanical analysis, DFR).
  • •Advanced packaging techniques experience (fan-out, 3D stacking, 2.5D, and MCM packaging).
Education:PhD / Doctorate in materials, mechanical, chemical, or electrical engineering
Skills:CommunicationProblem solvingOrganizational skillsInterpersonal skillsPresentation skills
Tech Stack:BEOL integrationTSV (through silicon via)Hybrid bonding (CoW and W2W)FMEATV designDFMDFYDOEMaterial selectionsProcess window validationFailure analysis (FA)Defect detectionCPIThermo-mechanical analysisDFRFan-out3D stacking2.5DMCM (multi chip module)Defect metrology

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn