Wafer Bond Process Development Engineer

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: bachelorsSkills: ["Problem-solving","Communication","Leadership","Cross-functional teamwork","Project organization"]

Develop wafer bonding process technology to meet DRAM roadmap requirements, owning process development and sustaining existing processes. Collaborate with process integration, equipment, and manufacturing teams to implement solutions, optimize process capability, and reduce cost and variability. Apply model-based problem solving and strong logic to improve processes across area equipment, SPC principles, and recipe management while working in a highly collaborative semiconductor R&D environment.

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Micron Technology
Micron Technology
6 months ago

Wafer Bond Process Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Develop wafer bonding process technology to meet DRAM roadmap requirements, owning process development and sustaining existing processes. Collaborate with process integration, equipment, and manufacturing teams to implement solutions, optimize process capability, and reduce cost and variability. Apply model-based problem solving and strong logic to improve processes across area equipment, SPC principles, and recipe management while working in a highly collaborative semiconductor R&D environment.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Own process development and sustaining activities for wafer bonding.
  • •Collaborate with equipment, process development, and process integration teams to design and implement process engineering solutions.
  • •Optimize processes and equipment to reduce cost, variability, and improve process capability.
  • •Use model-based problem solving and strong logic to address tactical and technical challenges.
  • •Apply understanding of process flows, SPC principles, and recipe management to meet physical and electrical requirements.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysIncome Protection

Key Requirements

  • •Bachelor of Science with 3+ years of experience, or Master of Science/PhD in a technical field (e.g., Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics).
  • •Hands-on experience with wafer bonding.
  • •Knowledge of DRAM or other memory technologies.
  • •Ability to effectively communicate with diverse audiences.
  • •Preferred: hands-on experience with wafer bonding, photolithography, wet process, thin films, and wafer thinning (grind and CMP).
Experience:3+ yearsSemiconductor manufacturingDRAMR&DWafer processing
Education:Bachelor's in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics (or related technical fields)
Skills:Problem-solvingCommunicationLeadershipCross-functional teamworkProject organization
Tech Stack:Wafer bondingPhotolithographyWet processThin filmsWafer thinningCMPSPCRecipe managementModel-based problem solvingDRAM

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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