Packaging Engineer

AMD
Suzhou
Workplace: OnsiteFull timeCNY 273,840 - 391,200 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Cross-functional project management","Conflict management","Analytics","Troubleshooting","Interpersonal skills","Presentation skills","Communication skills","Writing skills"]

Drive supplier engagement for external flip-chip and advanced packaging processes, ensuring key performance metrics like yield and excursion-free delivery. Plan and lead new product introduction and ramp-up readiness, manage issue resolution and prevention, and monitor manufacturing performance across yield and out-of-control lots. Support change management and continuous improvement initiatives, occasionally traveling for audits and regional supplier needs.

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FursaFursa
AMD
AMD
2 days ago

Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Drive supplier engagement for external flip-chip and advanced packaging processes, ensuring key performance metrics like yield and excursion-free delivery. Plan and lead new product introduction and ramp-up readiness, manage issue resolution and prevention, and monitor manufacturing performance across yield and out-of-control lots. Support change management and continuous improvement initiatives, occasionally traveling for audits and regional supplier needs.
Location: Suzhou
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Drive supplier engagement for continuous improvement and delivery of new capabilities ahead of need.
  • •Plan and drive New Product Introduction activities and ramp-up readiness.
  • •Lead issue resolution and prevention with leading indicators to proactively identify risks.
  • •Execute special work requests with comprehensive reporting and monitor manufacturing performance (yield, out-of-control lots, and outliers).
  • •Plan and execute change management and drive continuous improvement in process simplification and quality enhancement; occasionally support on-site audits and travel.
Travel: Low travel

Pay and Benefits

Salary: CNY 273,840 - 391,200 annually

Key Requirements

  • •Strong knowledge of bumping/fan-out/RDL processes for flip-chip assembly and advanced package development (flip-chip assembly advantage).
  • •Track record of 5+ years leading process development work that reached volume production in a semiconductor ASIC facility.
  • •Familiarity with tools including AI agents, JMP, and Minitab, with failure analysis and package reliability knowledge.
  • •Good English speaking, communication, and writing skills, with strong interpersonal and leadership abilities.
  • •Bachelor’s or MS degree in Mechanical, Material, or Chemical Engineering.
Experience:5+ yearsSemiconductorASICProcess development
Education:Bachelor's in Mechanical or Material or Chemical Engineering
Skills:Cross-functional project managementConflict managementAnalyticsTroubleshootingInterpersonal skillsPresentation skillsCommunication skillsWriting skills
Languages:English
Tech Stack:JMPMinitabAI agentsESDJedec

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn