Boeing Engineering & Technology Innovation Graduate Researcher Program, Microelectronics R&D Intern

Boeing
United States
Workplace: OnsiteFull timeUSD 90,000+ annuallyFunction: Research & Scientific (R&D)Education: phdSkills: ["Analytical skills","Problem-solving","Communication","Collaboration"]

Join Boeing’s Graduate Researcher Program in Engineering & Technology Innovation to conduct hands-on microelectronics R&D for aerospace systems. Work onsite for 10–12 weeks in Summer 2027 within a Microelectronics Technology team developing digital, analog, mixed-signal, and RF systems-on-chip (SoCs). Collaborate with senior engineers and mentors, apply research to emerging challenges, and document results for technical leaders and internal R&D knowledge bases.

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Boeing
Boeing
3 days ago

Boeing Engineering & Technology Innovation Graduate Researcher Program, Microelectronics R&D Intern

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Job Summary

Join Boeing’s Graduate Researcher Program in Engineering & Technology Innovation to conduct hands-on microelectronics R&D for aerospace systems. Work onsite for 10–12 weeks in Summer 2027 within a Microelectronics Technology team developing digital, analog, mixed-signal, and RF systems-on-chip (SoCs). Collaborate with senior engineers and mentors, apply research to emerging challenges, and document results for technical leaders and internal R&D knowledge bases.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Intern level

Key Responsibilities

  • •Conduct R&D in advanced microelectronics, including design, verification, modeling, test, or analysis of digital, analog, mixed-signal, or RF circuits, sub-systems, and SoCs for high-performance aerospace applications.
  • •Apply expertise to emerging microelectronics challenges in AI, radar, EW, navigation, and secure communication systems.
  • •Collaborate with senior Boeing engineers, researchers, and mentors to transition research concepts into viable technologies for Boeing programs.
  • •Document findings and present results to technical leaders.
  • •Contribute to internal R&D knowledge bases through recorded research outcomes.

Pay and Benefits

Salary: USD 90,000 annually
Perks:Health InsuranceRetirement SavingsLife InsuranceDisability InsuranceRelocation

Key Requirements

  • •Complete the first year of PhD studies by July 2027.
  • •Be pursuing a PhD in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related discipline.
  • •Have coursework or research experience in areas such as digital logic design/verification, SoC architecture/integration, semiconductor device physics, CMOS/BiCMOS fabrication, analog/mixed-signal circuit design, or RF/millimeter-wave circuit design.
  • •Be able to work full-time for 10–12 weeks during Summer 2027.
  • •Demonstrate strong analytical, problem-solving, and communication skills.
Experience:AerospaceMicroelectronicsResearch
Education:PhD / Doctorate in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related discipline
Skills:Analytical skillsProblem-solvingCommunicationCollaboration
Tech Stack:MicroelectronicsDigital logicVerificationSystem-on-Chip (SoC)CMOSBiCMOSAnalog/mixed-signal circuit designRFMillimeter-wave circuit designEDA toolsCadenceSynopsysSiemens EDAAIRadarEWNavigationSecure communication

Eligibility

Security Clearance:Secret

Company Brief

Boeing
Designs, manufactures, and services commercial airplanes, defense systems, space vehicles, and related products and services globally. Boeing serves airlines, governments, and commercial customers with aerospace and defense technologies and integrated support solutions.
Industry: Aerospace Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Arlington, United States
Founded: 1916
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