Principal Engineer / MTS – NAND Process Pathfinding – Dry Etch

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Problem-solving","Communication","Presentation skills","Technical leadership","Mentoring"]

Lead next-generation plasma dry etch pathfinding for NAND scaling, architecting and deploying etch solutions that improve structure control, performance, and yield. Develop and qualify ICP/CCP plasma etch processes, evaluate plasma chemistries and hardware, and drive profile/CD management for advanced pattern transfer and high aspect ratio etching. Partner across process integration, thin films, lithography, CMP, device, and AI-enabled digital engineering to accelerate R&D productivity.

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Micron Technology
Micron Technology
4 weeks ago

Principal Engineer / MTS – NAND Process Pathfinding – Dry Etch

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Last checked: 17 hours agoStatus: Live

Job Summary

Lead next-generation plasma dry etch pathfinding for NAND scaling, architecting and deploying etch solutions that improve structure control, performance, and yield. Develop and qualify ICP/CCP plasma etch processes, evaluate plasma chemistries and hardware, and drive profile/CD management for advanced pattern transfer and high aspect ratio etching. Partner across process integration, thin films, lithography, CMP, device, and AI-enabled digital engineering to accelerate R&D productivity.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and refine dry etch processes to meet NAND roadmap requirements for structure, performance, and yield.
  • •Guide development of next-generation etch solutions including high aspect ratio patterning, selective etch, profile control, and CD management.
  • •Evaluate new plasma chemistries, process technologies, and hardware to enable future device scaling.
  • •Collaborate with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, Device, and other teams to improve technology development and manufacturability.
  • •Use AI-enabled engineering tools, advanced analytics, and digital workflows to accelerate process development and enhance knowledge management across thin film technology initiatives.

Key Requirements

  • •Extensive experience in ICP/CCP plasma etch for advanced semiconductor process development.
  • •Deep understanding of plasma etch equipment, plasma-surface interactions, etch chemistry, and profile control.
  • •Solid foundation in plasma physics, transport phenomena, and materials interactions.
  • •Demonstrated experience in developing and qualifying advanced dry etch processes.
  • •Familiarity with AI/ML, statistical modeling, data analytics, and digital engineering methodologies.
Experience:Semiconductor process developmentNANDDry etchPlasma etching
Skills:Problem-solvingCommunicationPresentation skillsTechnical leadershipMentoring
Tech Stack:ICP/CCP plasma etchPlasma etch equipmentPlasma physicsAI/MLMachine learningStatistical modelingData analyticsDigital engineeringAI-enabled engineering tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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