Foveros Direct Pathfinding Integration

Intel
United States
Workplace: OnsiteFull timeUSD 141,910 - 269,100 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 6+ yearsEducation: bachelorsSkills: []

Apply scientific and engineering principles to design, develop, and qualify semiconductor packaging solutions and materials. Lead packaging development from artwork concepts and prototypes through qualification testing, specification documentation, and coordination with manufacturing, regulatory, logistics, and supply chain partners. Partner across organizations on product launch and packaging requirements, including SKU, barcodes, labeling, scaling, and bills of materials for distribution channel shipments.

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Intel
Intel
5 months ago

Foveros Direct Pathfinding Integration

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live
Reposted: similar role first listed 1 month ago

Job Summary

Apply scientific and engineering principles to design, develop, and qualify semiconductor packaging solutions and materials. Lead packaging development from artwork concepts and prototypes through qualification testing, specification documentation, and coordination with manufacturing, regulatory, logistics, and supply chain partners. Partner across organizations on product launch and packaging requirements, including SKU, barcodes, labeling, scaling, and bills of materials for distribution channel shipments.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Design, develop, and qualify packaging solutions and materials to hold, display, dispense, and safely transport products.
  • •Manage the packaging development process from artwork and concepts through prototypes, qualification testing, specifications, and coordination across manufacturing, regulatory, logistics, and supply chain partners.
  • •Lead vendor selection and qualification, support manufacturing startup, and benchmark performance.
  • •Consult cross-organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory/compliance, and bills of material requirements for shipments.
  • •Identify and implement processes to improve efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and packaging supply chain.

Pay and Benefits

Salary: USD 141,910 - 269,100 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in engineering, Materials Science, Chemistry, Physics, or related field and 6+ years of relevant experience; or Master’s with 4+ years; or PhD with 4+ years.
  • •Experience in packaging engineering, process development, and technology innovation.
  • •Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
  • •Expertise in qualification testing, specification documentation, and packaging material certification.
  • •Experience in advanced packaging technology development and strategic supplier management (preferred).
Experience:6+ years
Education:Bachelor's in Engineering, Materials Science, Chemistry, Physics, or a related field
Tech Stack:Hybrid Bonding Process

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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