Foveros Direct Pathfinding Integration
Phoenix
Workplace: OnsiteFull timeUSD 141,910 - 269,100 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 6+ yearsSkills: ["Packaging engineering","Cross-functional collaboration","Problem-solving","Teamwork","Communication"]Join Intel's packaging team to design, develop, and qualify advanced semiconductor packaging solutions for Foveros-based integration. Lead packaging development, artwork concepts, prototypes, qualification testing, and documentation; coordinate with manufacturing, regulatory, logistics, and supply chain partners; drive efficiency, cost reduction, sustainability, and supplier engagement across on-site U.S. locations.
