Senior Member of Technical Staff / Member of Technical Staff, DRAM Design Engineer, Next-generation HBM Architecture

Micron Technology
Texas
Workplace: OnsiteFull timeFunction: Architecture & Urban PlanningExperience: 8+ yearsEducation: mastersSkills: ["Communication","Technical analysis","Data-driven influence"]

Design and optimize next-generation 3D-stacked DRAM for high-bandwidth memory (HBM) used in emerging AI systems. You’ll architect and validate novel DRAM circuit approaches, run schematic and SPICE simulations to assess power/performance/area tradeoffs, and collaborate with layout, test, and yield teams. Maintain clear architecture documentation and partner across stack, memory systems, and SoC microarchitecture experts to deliver performance and efficiency improvements.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

Senior Member of Technical Staff / Member of Technical Staff, DRAM Design Engineer, Next-generation HBM Architecture

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Last checked: 6 hours agoStatus: Live

Job Summary

Design and optimize next-generation 3D-stacked DRAM for high-bandwidth memory (HBM) used in emerging AI systems. You’ll architect and validate novel DRAM circuit approaches, run schematic and SPICE simulations to assess power/performance/area tradeoffs, and collaborate with layout, test, and yield teams. Maintain clear architecture documentation and partner across stack, memory systems, and SoC microarchitecture experts to deliver performance and efficiency improvements.
Location: Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Architecture & Urban Planning
Seniority: Sr. Manager level

Key Responsibilities

  • •Identify and develop novel DRAM circuit architectures for next-generation AI workload requirements.
  • •Collaborate with peers to find DRAM circuit bottlenecks and define architectural hypotheses.
  • •Validate hypotheses using schematic-level design, SPICE simulation, and PPA tradeoff analysis.
  • •Partner with layout designers on floorplanning studies.
  • •Define and optimize design-for-test and design-for-yield implementation; maintain architecture documentation.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental Leave

Key Requirements

  • •8+ years of proven experience delivering DRAM-based memory designs.
  • •Strong mixed-signal design experience, including custom analog and synthesis flows.
  • •DRAM circuit design experience across areas such as cell arrays, sense amplifiers, row/column decoders, periphery, IO, and/or power distribution.
  • •Engineering experience with SPICE-based tools (e.g., FineSim, HSPICE).
  • •A Masters or PhD in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience.
Experience:8+ yearsSemiconductorsDRAMHBM
Education:Master's in Computer Science, Computer Engineering, Electrical Engineering, or equivalent
Skills:CommunicationTechnical analysisData-driven influence
Tech Stack:SPICEFineSimHSPICEPythonPerlVerilog

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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