Lead ASIC Package Design Automation and AI Engineer

AMD
Santa Clara, California
Workplace: HybridFull timeUSD 149,380 - 256,080 annuallyFunction: Data Science & Machine LearningEducation: bachelorsSkills: ["Problem-solving","Ownership","Communication","Collaboration","Cross-functional teamwork"]

Build and deploy AI-driven automation workflows to accelerate complex semiconductor package design for substrates, silicon interposers, and bridge-based architectures. Apply AI/ML to improve tasks like auto-routing, placement optimization, and SI/PI-related design quality, while partnering with package design teams, EDA tool teams, and vendors to integrate automation features and enable closed-loop optimization for next-generation packaging. Support milestones through tape-outs and contribute reusable workflows and best practices.

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FursaFursa
AMD
AMD
2 days ago

Lead ASIC Package Design Automation and AI Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Build and deploy AI-driven automation workflows to accelerate complex semiconductor package design for substrates, silicon interposers, and bridge-based architectures. Apply AI/ML to improve tasks like auto-routing, placement optimization, and SI/PI-related design quality, while partnering with package design teams, EDA tool teams, and vendors to integrate automation features and enable closed-loop optimization for next-generation packaging. Support milestones through tape-outs and contribute reusable workflows and best practices.
Location: Santa Clara, California
Workplace: Hybrid
Employment Type: Full time
Job Function: Data Science & Machine Learning

Key Responsibilities

  • •Develop, deploy, and maintain automation frameworks and AI-assisted workflows for package substrates, silicon interposers, and bridge-based integration.
  • •Use AI/ML methods to enhance design activities including auto-routing, placement optimization, and design rule compliance/verification.
  • •Collaborate with package design teams to identify automation opportunities that reduce manual effort and improve robustness, quality, and cycle time.
  • •Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities, and support advanced packaging design enablement.
  • •Support design milestone execution and tape-outs by ensuring automation readiness and contributing documentation and reusable workflows.

Pay and Benefits

Salary: USD 149,380 - 256,080 annually

Key Requirements

  • •Translate complex package design challenges into scalable automation solutions.
  • •Work effectively across Design, EDA, and AI/ML teams in a multi-disciplinary environment.
  • •Strong problem-solving skills with an ownership mindset and ability to deliver high-quality results with limited supervision.
  • •Comfort collaborating across internal and external stakeholders with strong communication skills.
  • •Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.
Experience:Semiconductor packagingSOC physical design automationEDA toolsAI/ML engineering
Education:Bachelor's
Skills:Problem-solvingOwnershipCommunicationCollaborationCross-functional teamwork
Languages:English
Tech Stack:PythonTclSKILLC++PyTorchTensorFlowCadence APD / SiPSiemens XpeditionSynopsys 3DICCDRC/LVSSignal integrityPower deliveryParasitic extraction

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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