Lead ASIC Package Design Automation and AI Engineer
Santa Clara, California
Workplace: HybridFull timeUSD 149,380 - 256,080 annuallyFunction: Data Science & Machine LearningEducation: bachelorsSkills: ["Problem-solving","Ownership","Communication","Collaboration","Cross-functional teamwork"]Build and deploy AI-driven automation workflows to accelerate complex semiconductor package design for substrates, silicon interposers, and bridge-based architectures. Apply AI/ML to improve tasks like auto-routing, placement optimization, and SI/PI-related design quality, while partnering with package design teams, EDA tool teams, and vendors to integrate automation features and enable closed-loop optimization for next-generation packaging. Support milestones through tape-outs and contribute reusable workflows and best practices.
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