ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Analytical thinking","Critical thinking","Communication","Collaboration","Continuous learning"]

Serve as an individual contributor on Micron’s Package Development Engineering team for advanced packaging. Support next-generation memory/HBM packaging by transitioning new products from development to high-volume manufacturing. Partner with advanced packaging development, manufacturing, and global supplier teams, applying statistical methods (DOE), risk assessments (FMEA), and technology transfer practices. Integrate AI-assisted tools into daily work to improve efficiency, quality, and continuous improvement.

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FursaFursa
Micron Technology
Micron Technology
4 days ago

ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live
Reposted: similar role first listed 6 months ago

Job Summary

Serve as an individual contributor on Micron’s Package Development Engineering team for advanced packaging. Support next-generation memory/HBM packaging by transitioning new products from development to high-volume manufacturing. Partner with advanced packaging development, manufacturing, and global supplier teams, applying statistical methods (DOE), risk assessments (FMEA), and technology transfer practices. Integrate AI-assisted tools into daily work to improve efficiency, quality, and continuous improvement.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Support the transition of new HBM/advanced packaging products from development to high-volume manufacturing.
  • •Apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications.
  • •Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
  • •Perform risk assessments using FMEA, implement control plans, and drive corrective actions for abnormal conditions.
  • •Enable smooth technology transfer to high-volume manufacturing and integrate AI-assisted tools into daily work to improve efficiency and quality.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth InsuranceRecognition

Key Requirements

  • •Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.
  • •Operations support is required, including shift and weekend coverage.
  • •Strong analytical, logical, and critical thinking skills.
  • •Ability to collaborate across all levels and communicate effectively.
  • •Growth mindset with a passion for continuous learning; internship or semiconductor industry experience is a plus.
Experience:Semiconductor industry
Education:Bachelor's in Chemical Engineering, Materials Science, Electrical Engineering, or Mechanical Engineering
Skills:Analytical thinkingCritical thinkingCommunicationCollaborationContinuous learning
Tech Stack:AIAI-assisted toolsDesign of Experiments (DOE)Failure Mode & Effect Analysis (FMEA)MESJMPPythonAutomationData analyticsAI-enabled tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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