Process integration and Defect Reduction Engineer

Intel
Albuquerque
Workplace: OnsiteFull timeUSD 120,860 - 170,630 annuallyFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: bachelorsSkills: ["Teamwork","Leadership","Problem-solving","Prioritization","Communication"]

Support NM Si Manufacturing yield by sustaining process health for backend interconnect and advanced packaging across Fab 11X, with focus on Foveros and EMIB. Partner with Yield Engineering teams to design and execute experiments, analyze process/yield data, investigate excursions, identify root causes, and implement corrective actions. Manage technology change introductions and monitor inline defectivity and parametric performance while improving yield, quality, reliability, cost, and manufacturability during TD-to-HVM transitions.

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Intel
Intel
4 days ago

Process integration and Defect Reduction Engineer

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Last checked: 7 hours agoStatus: Live

Job Summary

Support NM Si Manufacturing yield by sustaining process health for backend interconnect and advanced packaging across Fab 11X, with focus on Foveros and EMIB. Partner with Yield Engineering teams to design and execute experiments, analyze process/yield data, investigate excursions, identify root causes, and implement corrective actions. Manage technology change introductions and monitor inline defectivity and parametric performance while improving yield, quality, reliability, cost, and manufacturability during TD-to-HVM transitions.
Location: Albuquerque
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Sustain process health as products transition from development to high-volume manufacturing, improving yield, quality, reliability, cost, and manufacturability.
  • •Design and execute experiments, analyze process and yield data, and optimize manufacturing processes to reduce defects and improve product performance.
  • •Manage technology change introductions, monitor inline defectivity and parametric performance, and investigate process excursions.
  • •Identify root causes and implement corrective actions to drive data-based improvements in yield and efficiency.
  • •Support transfer of new products from Technology Development into manufacturing to ensure readiness for successful high-volume production.

Pay and Benefits

Salary: USD 120,860 - 170,630 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s or Master’s degree in a technical field such as Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, or Physics.
  • •3+ years of experience in the semiconductor industry.
  • •3+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes.
  • •3+ years of experience applying Design of Experiments (DOE) methodologies.
  • •3+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.
Experience:3+ yearsSemiconductorAdvanced packaging
Education:Bachelor's in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field
Skills:TeamworkLeadershipProblem-solvingPrioritizationCommunication
Tech Stack:JMPSQLPCSDesign of Experiments (DOE)

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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