Hardware - Signal/Power Integrity Engineer (On-/Off-Chip)

FuriosaAI
Seoul
Workplace: OnsiteFull timeFunction: Energy & Utilities OperationsExperience: 8+ yearsEducation: bachelorsSkills: ["Collaboration","Problem-solving","Analytical thinking","Attention to detail","Cross-team communication"]

Define and validate SI/PI requirements from IP and system specifications, then run EM, circuit, and system-level simulations to ensure on-chip, package, and PCB robustness. Develop SI/PI methodologies for advanced packaging (chiplets, 3D-IC, die-to-die, chip-to-chip) and provide design guidance across stack-up, interconnect routing, PDN architecture, and decoupling. Partner with silicon, package, and board teams to align measurements with simulations and support lab debug/bbring-up.

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FursaFursa
FuriosaAI
FuriosaAI
1 week ago

Hardware - Signal/Power Integrity Engineer (On-/Off-Chip)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Define and validate SI/PI requirements from IP and system specifications, then run EM, circuit, and system-level simulations to ensure on-chip, package, and PCB robustness. Develop SI/PI methodologies for advanced packaging (chiplets, 3D-IC, die-to-die, chip-to-chip) and provide design guidance across stack-up, interconnect routing, PDN architecture, and decoupling. Partner with silicon, package, and board teams to align measurements with simulations and support lab debug/bbring-up.
Location: Seoul
Workplace: Onsite
Employment Type: Full time
Job Function: Energy & Utilities Operations
Seniority: Mid level

Key Responsibilities

  • •Define SI/PI requirements based on IP and system-level specifications.
  • •Perform SI/PI simulations at electromagnetic, circuit, and system levels.
  • •Develop SI/PI methodologies for advanced packaging technologies such as chiplet, 3D-IC, D2D, and C2C interfaces.
  • •Analyze and optimize SI/PI across on-chip, package, and PCB domains, including PDN architecture and decoupling strategy.
  • •Collaborate with silicon, package, and board teams to correlate measurements with simulations and support lab debug and bring-up when needed.

Key Requirements

  • •BS or MS in Electrical Engineering, Physics, or a related field.
  • •8+ years of experience in component- and system-level SI/PI analysis.
  • •Solid understanding of SI/PI fundamentals and methodologies.
  • •Hands-on experience with lab instruments such as VNA, TDR, and real-time oscilloscopes.
  • •Proficient in SI/PI EDA tools such as SIwave, HFSS, ADS, HSPICE, Allegro, RedHawk-SC, SC-ET, or RedHawk-3DIC.
Experience:8+ yearsSemiconductorAI compute hardwareAdvanced packagingHigh-speed digitalEM simulation
Education:Bachelor's in Electrical Engineering or Physics
Skills:CollaborationProblem-solvingAnalytical thinkingAttention to detailCross-team communication
Languages:English
Tech Stack:SIwaveHFSSADSHSPICEAllegroRedHawk-SCSC-ETRedHawk-3DICVNATDROscilloscopeEM simulationPCIeDDREthernet

Company Brief

FuriosaAI
Designs and develops data‑center AI inference accelerators (RNGD) and a full stack hardware‑software platform to deliver energy‑efficient, high‑performance AI compute for enterprise and cloud customers.
Industry: Hardware Devices
Company Size: Medium (51 to 250 employees)
Growth: Scaleup
Valuation: USD 500M to 1B
Funding: Series C
Headquarters: Seoul, South Korea
Founded: 2017
Glassdoor
Glassdoor: 4.6
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