Packaging Technical Leader

Cisco
San Jose
Workplace: HybridFull timeUSD 168,800 - 241,200 annuallyFunction: Administration & Executive AssistanceExperience: 6+ yearsSkills: ["Technical leadership","Cross-functional collaboration","Risk mitigation","Problem-solving","Data analysis"]

Drive innovation in advanced semiconductor packaging for Cisco’s ASIC and silicon photonics products. Lead technical efforts across package assembly, process development, reliability qualification, materials, and testing, partnering closely with design engineering, operations, supply chain, OSATs, fabs, and contract manufacturers. Use advanced problem-solving and physical failure analysis to resolve complex packaging issues and guide Design for Manufacturability/Reliability requirements for HVM.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Cisco
Cisco
7 months ago

Packaging Technical Leader

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Drive innovation in advanced semiconductor packaging for Cisco’s ASIC and silicon photonics products. Lead technical efforts across package assembly, process development, reliability qualification, materials, and testing, partnering closely with design engineering, operations, supply chain, OSATs, fabs, and contract manufacturers. Use advanced problem-solving and physical failure analysis to resolve complex packaging issues and guide Design for Manufacturability/Reliability requirements for HVM.
Location: San Jose
Workplace: Hybrid
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Lead advanced packaging technology efforts across 2.5D/3D, TSV, MCM, flip-chip, and heterogeneous integration, overseeing package assembly, process development, reliability qualification, materials, and testing.
  • •Partner with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products.
  • •Proactively identify, mitigate, and resolve highly complex packaging risks and issues, driving/supporting quality initiatives including failure analysis, root cause finding, and corrective actions.
  • •Collaborate with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM/DfR) for critical parameters used in HVM.
  • •Evaluate new packaging methods, materials, and processes for product design and implementation.

Pay and Benefits

Salary: USD 168,800 - 241,200 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kPaid ParentalLong-term DisabilityLife InsuranceEquityPaid HolidaysPaid LeaveSick TimePaid Volunteer

Key Requirements

  • •6+ years of progressive industry experience in semiconductor packaging/photonic packaging or assembly process development/integration with a track record of technical leadership and successful execution.
  • •Knowledge of advanced packaging processes (bumping, flip-chip, TSV, 2.5D/3D, MCM) and materials.
  • •Experience with package design and architecture, including advanced substrate manufacturing processes and impact on signal and power integrity.
  • •Experience with advanced problem-solving methodologies (e.g., 8D, FMEA, statistical process control) and data analysis.
  • •Knowledge and experience in physical failure analysis methods.
Experience:6+ yearsSemiconductor packagingPhotonic packagingAssembly process developmentPhysical failure analysis
Skills:Technical leadershipCross-functional collaborationRisk mitigationProblem-solvingData analysis
Tech Stack:2.5D/3DTSVMCMFlip-chipHeterogenous integrationPackage assemblyProcess developmentReliability qualificationMaterials and testingFailure analysis (FA)Root cause findingDfMDfRHVM8DFMEAStatistical process controlPhysical failure analysisCo-packaged opticsSimulation tools

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
Glassdoor
Glassdoor: 4.0
WebsiteLinkedInGlassdoor