SENIOR ENGINEER - DEMQRA HBM

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringEducation: mastersSkills: ["Analytical thinking","Experiment design","Data analysis","Problem-solving","Cross-functional collaboration"]

Establish quality criteria and monitor quality indices for High Bandwidth Memory (HBM) from FE/BE signals through NPI to high-volume manufacturing. Define and drive actions to prevent recurring quality and reliability issues, develop qualification stress flows and characterization, and partner with package, product, process, equipment, and 8D teams to set OQR specifications, investigate deviations, and drive corrective/preventive actions.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

SENIOR ENGINEER - DEMQRA HBM

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Last checked: 6 hours agoStatus: Live

Job Summary

Establish quality criteria and monitor quality indices for High Bandwidth Memory (HBM) from FE/BE signals through NPI to high-volume manufacturing. Define and drive actions to prevent recurring quality and reliability issues, develop qualification stress flows and characterization, and partner with package, product, process, equipment, and 8D teams to set OQR specifications, investigate deviations, and drive corrective/preventive actions.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Establish quality criteria and monitor outgoing quality and reliability (OQR) metrics using FE/BE production signals and reliability test results.
  • •Partner with package and product engineering to define quality/reliability fail modes and OQR specifications, then validate recognized and potential issues.
  • •Evaluate, characterize, and mitigate quality and reliability risks and fail modes for BE new products and HVM.
  • •Drive disposition deviation materials based on production signals and reliability test results with quick turnaround.
  • •Develop reliability test flows (design review, generate/verify stress and characterization flows, debug flow development issues, and optimize test performance).

Key Requirements

  • •M.S. (or equivalent experience) in Electrical Engineering, Materials Science, Computer Engineering, Semiconductor Engineering, Mechanical Engineering, or a related field.
  • •Familiarity with semiconductor wafer fabrication, advanced packaging, and semiconductor device physics.
  • •Strong knowledge of assembly processes, tools, failure modes, and chip-to-package issues.
  • •Experience with failure analysis and characterization techniques at package and silicon levels, especially for multi-chip-per-package products.
  • •Knowledge of stress/strain and associated failure modes, plus meticulous experiment design and data analysis skills, with familiarity with Perl, C++, and/or Python and test methodologies/flows.
Experience:SemiconductorsMemoryHBMAdvanced packagingManufacturingQualification
Education:Master's
Skills:Analytical thinkingExperiment designData analysisProblem-solvingCross-functional collaboration
Tech Stack:PerlC++PythonMicrosoft OfficeHTMLCGIJava

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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