Engineer, Process Integration PDE (Package Development Engineering)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Education: bachelorsSkills: ["Analytical thinking","Cross-functional collaboration","Learning agility","Communication","Growth mindset"]

Drive process integration excellence for HBM products during NPI, ensuring process readiness, yield ramp, and cross-module integration across post-wafer finishing, assembly, and test. Execute PI tasks with lot tracking and readiness activities, perform process characterization and yield/defect variability analysis, and support RCA/corrective actions. Partner with Fab, Assembly, Test, Yield, and Quality teams to mitigate risks early and deliver NPI milestones on time while leveraging AI-assisted tools for continuous improvement.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Engineer, Process Integration PDE (Package Development Engineering)

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Last checked: 7 hours agoStatus: Live

Job Summary

Drive process integration excellence for HBM products during NPI, ensuring process readiness, yield ramp, and cross-module integration across post-wafer finishing, assembly, and test. Execute PI tasks with lot tracking and readiness activities, perform process characterization and yield/defect variability analysis, and support RCA/corrective actions. Partner with Fab, Assembly, Test, Yield, and Quality teams to mitigate risks early and deliver NPI milestones on time while leveraging AI-assisted tools for continuous improvement.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Execute assigned HBM NPI PI tasks following defined procedures and phase-gate requirements.
  • •Support NPI builds via lot tracking, data collection, and readiness activities, and assist with NPI-to-HVM handoff documentation.
  • •Perform process characterization, Design of Experiments (DOEs), and window studies, including yield, defect, and variability analysis.
  • •Support root cause analysis (RCA) and implement corrective actions for scoped issues.
  • •Coordinate with Fab, Assembly, Test, Yield, and Quality teams; communicate status, risks, and issues and maintain technical documentation and reviews.

Key Requirements

  • •Bachelor’s or master’s degree in engineering or a related discipline.
  • •0–2 years of relevant experience in semiconductor manufacturing, process, or product engineering.
  • •Basic understanding of semiconductor process flows and process integration concepts.
  • •Familiarity with data analysis and basic statistics (Excel; JMP/Python preferred).
  • •Strong analytical skills, learning agility, and cross-functional collaboration mindset.
Experience:0Semiconductor manufacturing
Education:Bachelor's
Skills:Analytical thinkingCross-functional collaborationLearning agilityCommunicationGrowth mindset
Tech Stack:ExcelJMPPythonAI-enabled toolsDesign of Experiments (DOEs)Lot tracking

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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